Probe Pin Alloy Composition for Suppressing Solder Diffusion
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Solution Overview
Problem
Existing probe materials, such as AgPdCu alloy, suffer from rapid tip end consumption due to solder component diffusion during electrical inspections, leading to fluctuating contact resistance and reduced inspection efficiency.
Innovation Solution
A probe material composed of 40-95% Pt, 0.5-50% Cu, and 3-50% Ni is developed to suppress solder component diffusion through the formation of a thin intermetallic compound layer, maintaining adequate hardness and specific resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If AgPdCu alloy is used as probe material, then shape stability and low specific resistance are achieved, but solder component diffusion occurs during inspection causing tip end consumption
Solution Approach 1:
The patent changes the compositional parameters of the probe material by replacing AgPdCu alloy with a Pt-based alloy containing specific proportions of Cu (0.5-50 mass%) and Ni (3-50 mass%). This parameter change transforms the material's resistance to solder component diffusion while maintaining electrical conductivity and mechanical properties.
Solution Approach 2:
The patent creates a composite alloy material combining Pt, Cu, and Ni in specific proportions. This composite structure leverages the complementary properties of each element: Pt provides base stability and conductivity, Cu enhances ductility and conductivity, and Ni provides hardness and solder resistance, collectively solving the tip end consumption problem.
2Productivity
If probe material is used in repeated contact with solder, then inspection can be performed, but contact resistance fluctuates due to diffusion
Solution Approach 1:
The patent develops a probe material with superior solder resistance that maintains stable contact resistance over extended inspection periods, eliminating the need for frequent cleaning or replacement. This extends the service life of the probe pin tip end, reducing maintenance interruptions and maintaining inspection reliability.
3Reliability
If Pt content is increased to improve corrosion resistance, then solder resistance improves, but hardness becomes insufficient
Solution Approach 1:
The patent applies local quality by strategically distributing different elements within the alloy structure. Pt provides the base matrix with corrosion and solder resistance, while Cu and Ni are distributed throughout to provide localized hardening and strength enhancement without compromising the overall solder resistance property.
Solution Approach 2:
The patent optimizes the parameter relationships between Pt, Cu, and Ni content to achieve the desired balance. By controlling Cu (0.5-50 mass%) and Ni (3-50 mass%) within specific ranges relative to Pt content, the material achieves both sufficient hardness and solder resistance simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new alloy material effectively prevents solder component diffusion, ensuring stable contact resistance and prolonged probe pin life by forming a dense intermetallic layer at the interface, thereby enhancing inspection efficiency.
Implementation Method 1
a solder component such as Sn and a component of the probe material interdiffuse owing to the resulting Joule heat or the like
Implementation Method 2
the inventors of the present invention have found a probe material consisting of: 40 mass % or more and 95 mass % or less of Pt; 0.5 mass % or more and 50 mass % or less of Cu; and 3 mass % or more and 50 mass % or less of Ni
Implementation Method 3
an electrical current flows therebetween. As a result, a solder component such as Sn and a component of the probe material interdiffuse owing to the resulting Joule heat
Data Source
AI summary
An object of the present invention is to provide an alloy material for probe pins that can suppress the diffusion of components between solder in the circuit connecting portion of an inspection target and a probe material during probe inspection. The alloy material for probe pins of the present invention consists of: 40 mass % or more and 95 mass % or less of Pt; 0.5 mass % or more and 50 mass % or less of Cu; and 3 mass % or more and 50 mass % or less of Ni.