Probe Pin Cleaning Pad Layered Structure for Scratch Reduction

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Solution Overview

Problem

Impurities and scratches on probe pins can affect the accuracy of electronic component tests, as existing cleaning methods are inadequate in effectively removing substances and preventing scratches.

Innovation Solution

A probe pin cleaning pad comprising a foam layer, a cleaning layer, and a polishing layer, where the cleaning layer is sandwiched between the foam and polishing layers, is used to adhere to and remove substances from the probe pins, reducing scratches and improving cleaning efficacy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing cleaning methods are used to remove substances from probe pins, then cleaning is performed, but scratches are caused on the probe pins

Engineering Contradiction:

Improvecleaning efficacyVSAvoidscratches on probe pin

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The cleaning pad is divided into three distinct layers: a foam layer, a cleaning layer, and a polishing layer. Each layer performs a specific function - the foam layer provides cushioning, the cleaning layer removes substances through adhesion, and the polishing layer smooths the surface. This segmentation allows the cleaning function to be separated from the scratching function, enabling effective cleaning without causing scratches.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cleaning pad uses a composite structure combining different materials with complementary properties. The foam layer provides mechanical cushioning, the cleaning layer uses adhesive properties to capture contaminants, and the polishing layer provides gentle abrasion. This composite material approach allows the pad to simultaneously clean effectively while protecting the probe pin surface from damage.

Inventive Principle:

Principle #40Composite materials

2Reliability

If cleaning methods apply sufficient force to remove substances, then cleaning efficacy is improved, but scratches are more likely to occur on the probe pin

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidsurface damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The foam layer is positioned as the first layer in contact with the probe pin, providing cushioning and distributing applied pressure before it reaches the cleaning and polishing layers. This beforehand cushioning prevents concentrated forces that would cause scratches, while still allowing sufficient overall pressure to be applied for effective substance removal by the subsequent layers.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cleaning pad effectively reduces scratches on probe pins and enhances the cleaning process by utilizing a cleaning layer with appropriate hardness and modulus to adhere and remove substances without causing damage, improving the reliability of electronic component tests.

Implementation Method 1

the cleaning layer is adapted to adhere to and cover a substance on the probe pin

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20240069069A1Probe pin cleaning pad and cleaning method for probe pin

Publication Date: 2024.02.29 ALLIANCE MATERIAL CO LTD

AI summary

A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.