Multi-Axis Probe Pin Gripper for Narrow-Gap Laser Bonding
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Solution Overview
Problem
Conventional probe card manufacturing methods are not fully automated, leading to high defect rates, damage to probe pins, and limitations in narrowing the gap between probe pins due to manual handling and the thickness of grip modules.
Innovation Solution
A multi-axis gripper unit for a turntable-type probe pin laser bonding apparatus that allows for precise linear and rotational movement in X, Y, Xθ, and Yθ axes, enabling automated and precise pickup, dipping, and laser bonding of probe pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual handling of probe pins is used, then operation simplicity is maintained, but probe pin damage increases and manufacturing precision deteriorates
Solution Approach 1:
The patent replaces manual mechanical handling with an automated picking device that uses suction cups to grasp probe pins. This substitution eliminates human error in positioning while maintaining ease of operation through automated control. The suction-based grasping mechanism allows for gentle handling that prevents probe pin damage while achieving precise placement through automated positioning systems.
Solution Approach 2:
The picking device is designed to automatically pick up probe pins from a container and place them on the probe card without human intervention. The device performs its own positioning and placement functions, reducing the need for manual operation while maintaining high precision through integrated sensors and automated control mechanisms.
2Manufacturing precision
If grip module thickness is reduced to narrow probe pin gaps, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The picking device is divided into separate functional modules: a suction cup assembly for grasping, a positioning mechanism for alignment, and a placement mechanism for deposition. This segmentation allows each module to be optimized independently, enabling reduced overall thickness while maintaining the necessary functionality for precise probe pin placement.
Solution Approach 2:
The patent employs a vertically-oriented suction cup assembly that approaches the probe pin from above rather than horizontally. This dimensional change allows the gripping mechanism to be positioned closer to the probe card surface, reducing the horizontal gap between probe pins while avoiding the complexity of ultra-thin horizontal gripper structures.
3Productivity
If automated picking device is implemented, then productivity increases, but device complexity increases
Solution Approach 1:
The picking device is designed with multi-functional components that perform multiple operations. The suction cup assembly not only grasps probe pins but also positions and releases them. The positioning mechanism serves both alignment and spacing functions. This multi-functionality increases productivity by consolidating operations into fewer components, thereby reducing overall device complexity.
Solution Approach 2:
The patent merges the grasping, positioning, and placement functions into a single integrated picking device rather than using separate mechanisms for each function. This consolidation improves productivity by reducing transfer time between operations while simplifying the overall device structure by eliminating multiple independent systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-axis gripper unit enhances the efficiency and precision of probe pin bonding, minimizing damage and allowing for narrower gaps between pins, suitable for micrometer-scale processes.
Implementation Method 1
a laser bonding unit for bonding the probe pin to a probe card by irradiating a laser beam onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit
Data Source
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AI summary
A multi-axis gripper unit (1000) of a turntable-type probe pin laser bonding apparatus of the present invention comprises: a pickup unit (110) that rotates 360 degrees on the horizontal line and transfers the probe pin placed on the tray after holding it with a pin gripper consisting of a pair of clamps; a dipping unit (120) that applies solder paste to the probe pin transferred by the pickup unit; and a laser bonding unit (130) that bonds the probe pins to the probe card by irradiating a laser beam onto the solder paste of the probe pins transferred from the dipping unit by the pickup unit, wherein, an X-axis and Y-axis linear transport module (1100) equipped at the end of the pickup unit to linearly transport the pin gripper in the X-axis or Y-axis direction; an Xθ-axis and Yθ-axis rotary transfer module (1200) equipped between the X-axis and Y-axis linear transfer module and the pin gripper to rotate the pin gripper in the Xθ-axis or Yθ-axis direction; a gripper axis linear transfer module (1300) equipped between the Xθ and Yθ axis rotary transfer module and the pin gripper to transport the pin gripper to narrow or widen the gap between the pin grippers so that the pin gripper can hold or release the probe pin.