Probe Pin Gripping Structure for Small Wafer Adaptability
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Solution Overview
Problem
Existing probe pins face issues with uniform elastic force distribution, tip damage during contact, and reduced durability due to shortened lengths, especially when dealing with smaller wafer chips, which complicates mass production and precision maintenance.
Innovation Solution
A probe pin design featuring first and second extension portions with elasticity provision holes and a gripping part to maintain rigidity and prevent distortion during mounting, allowing for improved elastic force distribution and precise bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the probe pin length is reduced to 1.5 mm or less to cope with smaller wafer chips, then adaptability to smaller wafer chips is improved, but durability of the gripper deteriorates
Solution Approach 1:
The probe pin is divided into distinct segments: a pin body, a gripping part, and an elastic part with multiple elasticity provision holes. This segmentation allows each part to be optimized independently - the gripping part can be maintained at sufficient length for durability while the overall probe pin length is reduced to 1.5 mm or less for compatibility with smaller wafer chips.
2Device complexity
If the elastic part is constituted as a single component, then device complexity is reduced, but uniformity of elastic force distribution deteriorates
Solution Approach 1:
Multiple elasticity provision holes with different shapes are strategically distributed within the elastic part to create localized elastic properties. This ensures uniform elastic force distribution across the contact area while maintaining a relatively simple single-component structure that can be manufactured as one piece.
3Adaptability or versatility
If the gripper length is reduced to 200 μm to cope with Y size of 3.5 mm, then adaptability to smaller wafer chips is improved, but durability of the gripper deteriorates
Solution Approach 1:
The probe pin structure separates the gripping part from the elastic part, allowing the gripping part to be optimized for durability with sufficient length while the overall probe pin length is controlled at 1.5 mm or less. This segmentation resolves the conflict between needing a durable gripper and accommodating smaller wafer chip sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances rigidity and prevents tip lifting during bonding, enabling precise and durable probe pin assembly suitable for smaller wafer chips, improving mass production and bonding precision.
Implementation Method 1
the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part
Data Source
AI summary
A probe pin having an improved gripping structure is disclosed. The disclosed probe pin includes a pin body including a plurality of holes and positioned at one side, a first extension portion extending upward from an outer side of the pin body, a second extension portion elongated from the other end of the first extension portion, further extending than the pin body in the other direction, and spaced apart from the pin body, and a tip part integrated with the second extension portion and having an end sharply protruding upward from an outer upper end of the second extension portion, in which the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part.