Semiconductor Probe Plate Post Bumps Heat Dissipation
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Solution Overview
Problem
Current semiconductor device probes face challenges in heat dissipation, current carrying capacity, deformation prevention, testing fine pitch pads, and cost-effective manufacturing, which affect their performance and yield.
Innovation Solution
The design includes a probe with a plate-shaped post and a beam structure featuring bumps on its surface, increasing the surface area and Reynolds number for enhanced heat dissipation, and a tip structure for direct contact with semiconductor devices, while maintaining a compact size to prevent deformation and support high current capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the probe surface area is increased to improve heat dissipation, then the temperature control is improved, but the probe size increases leading to deformation risk
Solution Approach 1:
The patent applies dimensionality change by transitioning from a conventional wire-shaped probe to a plate-shaped post structure. This dimensional transformation increases the surface area available for heat dissipation without proportionally increasing the probe's volume or footprint, thereby improving temperature control while maintaining compact dimensions that prevent deformation.
2Loss of energy
If the probe surface area is increased to improve heat dissipation, then the heat dissipation effect is improved, but the probe structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the post surface into multiple discrete bump structures rather than using a continuous complex surface. These bumps are arranged in an array pattern, which increases the effective surface area for heat dissipation while maintaining a relatively simple overall structure that is easier to manufacture and less complex than alternative designs.
3Power
If the probe current carrying capacity is increased, then the electrical performance is improved, but the probe temperature rises
Solution Approach 1:
The patent converts the harmful effect of heat generated by high current carrying capacity into a beneficial situation by designing the plate-shaped post with bumps that enhance heat dissipation. The increased surface area created by the plate structure and bump arrangements facilitates more effective heat transfer from the probe, allowing high current capacity to be maintained without excessive temperature rise.
4Stability of the object's composition
If the probe structure is made compact to prevent deformation, then the structural stability is improved, but the heat dissipation capability is reduced
Solution Approach 1:
The patent applies local quality by concentrating the heat dissipation function in specific localized regions (the bumps on the post surface) rather than requiring the entire probe structure to be large. This allows the majority of the probe to maintain a compact, stable configuration while the localized bump structures provide enhanced heat dissipation where needed most.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents temperature rise, increases current carrying capacity, allows for testing of fine pitch pads, and reduces manufacturing costs, thereby enhancing probe performance and yield.
Implementation Method 1
capable of increasing heat dissipation performance by increasing a surface area of the probe to prevent a temperature of the probe from rising above a certain value
Implementation Method 2
capable of increasing heat dissipation performance by increasing a Reynolds number at a surface of the probe to prevent a temperature of the probe from rising above a certain value
Data Source
AI summary
A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.