Probe Polishing via Transportable Substrate on Separate Mounting Table
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Solution Overview
Problem
Existing test devices face challenges in polishing probe needles without enlarging the device footprint and degrading throughput, as they lack a mechanism for transporting and exchanging needle tip contact portions efficiently.
Innovation Solution
A test device with separate mounting tables for testing and polishing, utilizing a transportable polishing substrate that can be automatically exchanged without removing the substrate under test, allowing for efficient polishing without increasing the device's footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate mounting table for polishing is provided, then probe polishing function is improved, but device footprint is enlarged
Solution Approach 1:
The polishing substrate is integrated onto the existing mounting table structure, combining the testing and polishing functions into a single integrated platform. This eliminates the need for a separate mounting table for polishing, thereby avoiding device footprint enlargement while maintaining the probe polishing function.
Solution Approach 2:
The mounting table is designed to be movable relative to the probe card through a movement mechanism. This dynamic positioning capability allows the same mounting table to serve both testing and polishing functions by adjusting its position, thus avoiding the need for additional stationary structures.
2Productivity
If a mechanism for transporting and exchanging needle tip contact portions is provided, then polishing efficiency is improved, but device complexity is increased
Solution Approach 1:
The polishing substrate is designed to be automatically exchanged through the existing transportation mechanism without requiring additional specialized equipment or complex manual operations. The system leverages its own existing transportation infrastructure to achieve automatic polishing substrate exchange, thereby improving polishing efficiency without significantly increasing device complexity.
3Area of stationary object
If the polishing substrate is made transportable by the transportation mechanism, then device compactness is maintained, but throughput may be degraded
Solution Approach 1:
Multiple polishing substrates are prepared in advance and stored in the transportation mechanism's accommodation space. The system is configured to automatically exchange polishing substrates during the transportation process, ensuring that a fresh polishing substrate is always available without interrupting the testing flow, thus maintaining both device compactness and high throughput.
Data Source
AI summary
A test device for testing a substrate is provided. The device comprises: a mounting table for test on which the substrate under test is mounted; a transportation mechanism to transport the substrate under test; a mounting table for polishing on which a polishing substrate is mounted; a first forward or backward movement mechanism to move the mounting table for test with respect to a probe; and a second forward or backward movement mechanism to move the mounting table for polishing with respect to the probe, wherein the mounting table for polishing is provided separately from the mounting table for test, a retreat region of the mounting table for test is opposite to a retreat region of the mounting table for polishing, and the second forward or backward movement mechanism is configured such that a portion of the polishing substrate overlaps the probe while the other portion of the polishing substrate does not overlap the probe.