Semiconductor Probe Device Position Variation Visualization
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Solution Overview
Problem
Current probe devices for testing semiconductor chips lack the capability to accurately measure and provide information on the positional variation of each chip, which is crucial for setting control parameters during the testing process due to variations in chip size and probe alignment.
Innovation Solution
A probe device equipped with an actual measurement data acquisition unit, a variation amount calculation unit, and an image generation unit to measure and visualize the positional variation of each chip, allowing for intuitive recognition and adjustment of probe contact positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment measurement is performed to calculate chip position variation, then measurement precision is improved, but loss of information occurs because users cannot access the variation amount data
Solution Approach 1:
The system implements feedback by displaying the measured chip position variation amounts back to users through visual representation. The variation amount calculation unit computes the differences between actual chip positions and standard positions, then the image generation unit presents this data in an easily interpretable format, enabling users to utilize the measurement information for control parameter adjustments.
2Manufacturing precision
If individual chip alignment is performed for every chip, then manufacturing precision is improved, but device complexity increases due to additional alignment requirements
Solution Approach 1:
The alignment system is segmented into distinct functional units: an actual measurement data acquisition unit that collects chip position data, a variation amount calculation unit that processes the data to determine deviations, and an image generation unit that visualizes the results. This segmentation allows the complex alignment task to be divided into manageable steps while maintaining high precision.
Solution Approach 2:
Instead of performing physical alignment adjustments for each chip, the system creates a digital copy or representation of the chip positions through measurement data. The variation amounts are calculated and displayed as visual information, allowing users to understand and compensate for position deviations without complex mechanical adjustments.
3Ease of operation
If chip position variation data is collected and displayed, then ease of operation is improved by enabling better control parameter setting, but device complexity increases due to additional measurement and processing functions
Solution Approach 1:
The system replaces complex mechanical alignment adjustment mechanisms with an information-based approach. Instead of requiring users to manually adjust mechanical components based on trial and error, the system uses measurement data acquisition, variation calculation, and visual display to provide immediate feedback, enabling users to set control parameters more easily and accurately.
Data Source
AI summary
A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.