Probe Detachment via Segmented Sacrificial Layer
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Solution Overview
Problem
The existing method for manufacturing probes for electrical testing of semiconductor integrated circuits is complex and time-consuming due to the need for precise etching to detach probes from a silicon base table without damaging them, requiring strict management of the etching process to avoid deformation and handling difficulties.
Innovation Solution
A probe manufacturing method that forms a recess with a sacrificial layer and a holding portion on the base table, allowing the probe to be detached after the sacrificial layer under the probe is removed, while leaving a sacrificial layer under the holding portion to maintain the probe's position, enabling easy detachment without excessive force or damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the etching process is extended to completely remove the sacrificial layer under the probe, then the probe can be detached from the base table, but the probe may float on the etchant and become difficult to handle
Solution Approach 1:
The sacrificial layer removal is segmented into two stages: first removing the sacrificial layer under the probe body to enable detachment, and leaving the sacrificial layer under the holding portion intact to maintain handleability. This segmentation resolves the contradiction by allowing probe detachment while preventing floating.
2Productivity
If the etching process time is reduced to simplify the manufacturing process, then the production efficiency increases, but the sacrificial layer may not be sufficiently removed, requiring strong detachment force that deforms the probe
Solution Approach 1:
The holding portion is designed with different local quality compared to the probe body - it has a larger area that retains sacrificial layer after etching. This local quality difference ensures the probe can be detached from the base table while the holding portion maintains sufficient adhesion, preventing probe deformation during detachment.
3Ease of operation
If a large amount of sacrificial layer remains after etching to ensure easy detachment, then the probe can be removed from the base table, but strong detachment force is required that may deform the probe
Solution Approach 1:
The sacrificial layer is segmented into two functional zones: the zone under the probe body is completely removed to enable detachment, while the zone under the holding portion retains sufficient thickness to provide gentle detachment force. This segmentation allows easy detachment without requiring excessive force that would deform the probe.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the probe manufacturing process by allowing for easy detachment without damage and reduces the need for strict etching time management, ensuring reliable and efficient production of probes.
Implementation Method 1
removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process
Implementation Method 2
depositing a probe material in the recess to form a probe
Data Source
AI summary
A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part. The auxiliary part is formed in a flat surface shape sufficient for a sacrificial layer part under the holding portion to remain when a sacrificial layer part under the probe is removed by the etching process. The probe is separated from the holding portion after the sacrificial layer part under the probe is removed and while the sacrificial layer part under the holding portion remains.