Probe Assembly with Downward-Protruding Shield for Semiconductor Testing

The guide plate is divided into an upper guide plate and a lower guide plate separated by a thin dielectric spacer plate. This segmentation allows the spacer plate to be much thinner than a single solid support structure would require, while the distributed support from both guide plates maintains overall structural stability. The segmentation enables reduced spacer thickness without compromising reliability.

The upper guide plate, lower guide plate, and dielectric spacer plate are combined to form an integrated probe assembly structure. The dielectric spacer plate is sandwiched between the two guide plates, creating a unified structure where the combined system provides both mechanical support and electrical isolation. This merging allows the thin spacer to function effectively within the larger stable assembly.

The dielectric spacer plate acts as an intermediary element between the upper and lower guide plates. It provides a reference surface and mechanical interface that facilitates precise alignment during assembly. The spacer plate's structured design includes features that guide probe placement and ensure accurate positioning, thereby maintaining manufacturing precision even at reduced thickness.

The patent replaces thick mechanical support structures with a thin dielectric spacer plate combined with upper and lower guide plates. This substitution uses the guide plates to provide the primary mechanical strength while the thin spacer plate provides positioning and electrical isolation. The guide plates' hole arrays and structural features replace the need for thick spacer material to maintain alignment precision.