Probe With Sloped Recess For Dense RF Connector Measurement
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Solution Overview
Problem
The proximity of RF circuit connectors in communication terminals hinders the effective use of conventional probes, leading to interference and reduced ability to densely pack circuit boards due to probe contact issues.
Innovation Solution
A probe design featuring multiple main body portions with central conductors bound by a first member, incorporating a recess portion with a sloped surface that allows smooth contact with measurement subjects, preventing probe-to-probe contact and enabling higher connector density on circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional probes are used to measure RF circuit connectors, then measurement capability is provided, but probe contact interference occurs when connectors are disposed close to each other
Solution Approach 1:
The probe head is divided into multiple independent probe units, each with its own contact tip. The probe units are arranged in a segmented pattern with spacing between them, allowing each probe to independently contact its target connector without interfering with adjacent probes. This segmentation enables measurement of closely-spaced connectors on the circuit board.
2Quantity of substance
If connectors are disposed close to each other on the circuit board to increase density, then miniaturization and increased density are achieved, but probe contact interference occurs during measurement
Solution Approach 1:
The probe design incorporates local quality variations in the probe unit arrangement. Different regions of the probe head have different densities and configurations of probe units matched to the local connector layout on the circuit board. This allows the probe to adapt to locally varying connector densities, enabling measurement of high-density connector regions without probe interference.
3Reliability
If the distance between connectors on the circuit board is increased to avoid probe contact interference, then measurement reliability is improved, but the circuit board cannot be miniaturized or densely packed
Solution Approach 1:
The probe units are arranged in a two-dimensional array on the probe head, allowing probes to access connectors in both horizontal and vertical directions. This multi-dimensional probe arrangement enables measurement of closely-spaced connectors by approaching them from different spatial angles, effectively utilizing three-dimensional space to resolve the two-dimensional density conflict on the circuit board.
Data Source
AI summary
A probe that enables a circuit board for electronic components, which is a measurement subject, to be disposed more densely. The probe is capable of simultaneously measuring a plurality of locations. The probe includes a plurality of main body portions having central conductors that make contact with connectors, and a first member that binds the plurality of main body portions together. A recess portion, having a base surface from which tip ends of the plurality of central conductors project, is provided in the first member. The recess portion has a sloped surface that flares outward from a base portion of the recess portion toward an opening in the recess portion.