Pt-Cu-Ni Probe Material for Solder Diffusion Resistance
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Solution Overview
Problem
The diffusion of components from solder into probes containing AgPdCu alloy results in wear, necessitating frequent cleaning or replacement, reducing the operation efficiency of inspection steps.
Innovation Solution
A probe composed of a material containing greater than or equal to 40 mass % and less than or equal to 95 mass % of Pt, greater than or equal to 0.5 mass % and less than or equal to 50 mass % of Cu, and greater than or equal to 3 mass % and less than or equal to 50 mass % of Ni is used to suppress component diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a probe containing AgPdCu alloy is used, then the probe can be electrically connected with solder, but components from solder diffuse into the probe causing wear
Solution Approach 1:
The patent changes the material composition parameters by specifying precise ranges of Ag (4-30 mass%), Pd (40-55 mass%), Cu (10-30 mass%), and In (0.1-5 mass%) to optimize the balance between electrical conductivity and diffusion resistance. This compositional parameter adjustment resolves the contradiction by creating an alloy that maintains electrical connectivity while suppressing component diffusion through the specific synergistic effect of these elements in the defined proportions
Solution Approach 2:
The patent creates a composite alloy material combining Ag, Pd, Cu, and In elements that work together to provide both electrical conductivity and diffusion barrier properties. The multi-element composite structure leverages the beneficial properties of each element: Ag for conductivity, Pd for diffusion resistance, Cu for conductivity and cost, and In for lowering melting point and improving wetting, thereby resolving the contradiction between electrical connection capability and wear resistance
2Loss of substance
If the distal end of the probe is frequently cleaned or replaced, then component diffusion is addressed, but the operation rate of inspection steps decreases
Solution Approach 1:
The patent applies preliminary action by pre-configuring the probe material with optimized AgPdCuIn composition before use, so that the probe inherently resists component diffusion from the outset. This preventive approach eliminates the need for frequent cleaning or replacement operations, thereby maintaining high productivity while addressing component diffusion issues through the material's intrinsic properties rather than requiring ongoing maintenance interventions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed material effectively reduces the wear of the probe's distal end by forming a dense metal compound at the interface, thereby minimizing component diffusion and maintaining probe integrity during repeated inspections.
Implementation Method 1
there is a tendency that components such as Sn contained in the solder and components contained in the probe are diffused into each other due to factors such as Joule heat
Data Source
AI summary
A probe including greater than or equal to 40 mass % and less than or equal to 95 mass % of Pt, greater than or equal to 0.5 mass % and less than or equal to 50 mass % of Cu, and greater than or equal to 3 mass % and less than or equal to 50 mass % of Ni.