Probe Assembly Stability in Memory Testing Apparatus
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Solution Overview
Problem
Conventional memory testing apparatuses often result in unstable connections between memory chips and electrical sockets, leading to incorrect testing results due to human or robotic errors during chip insertion.
Innovation Solution
A testing apparatus with a chip carrying device and electrically connecting units featuring a main body, supporting structure, lift structure, elastic assembly, and probe assemblies, which securely engage and connect chips through a pressing mechanism to ensure stable electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory chips are inserted into electrical sockets by human or robotic arm, then the testing apparatus can operate, but the connection between chips and sockets becomes unstable leading to incorrect testing results
Solution Approach 1:
The probe assemblies are designed to be movable relative to the circuit board, allowing them to dynamically adjust their position to maintain optimal contact with the chip contacts. The elastic assemblies provide continuous pressure to ensure stable electrical connection while accommodating minor position variations, resolving the instability issue of manual/robotic insertion.
Solution Approach 2:
The elastic assemblies automatically apply pressing force to the probe assemblies, enabling the system to self-regulate and maintain stable contact without external intervention. This self-service mechanism ensures consistent connection quality, eliminating the human error and instability associated with manual or robotic arm insertion.
2Ease of operation
If manual or robotic arm insertion is used, then chip loading is simple, but connection stability deteriorates causing good chips to be misclassified as defective
Solution Approach 1:
The elastic assemblies automatically apply pressing force to the probe assemblies, enabling the system to self-regulate and maintain stable contact without external intervention. This self-service mechanism ensures consistent connection quality, eliminating the human error and instability associated with manual or robotic arm insertion.
Solution Approach 2:
The elastic assemblies act as intermediaries between the rigid circuit board and the chip contacts, providing a compliant connection that absorbs position variations and maintains stable electrical contact. This intermediary mechanism preserves the simplicity of chip loading while ensuring reliable connection stability.
3Device complexity
If probe assemblies are fixed to circuit board, then structure is simple, but inability to adjust position prevents stable contact with chip contacts
Solution Approach 1:
The probe assemblies are designed to be movable relative to the circuit board, allowing them to dynamically adjust their position to maintain optimal contact with the chip contacts. The elastic assemblies provide continuous pressure to ensure stable electrical connection while accommodating minor position variations, resolving the instability issue of manual/robotic insertion.
Solution Approach 2:
The testing apparatus is segmented into movable probe assemblies that can independently adjust their positions relative to the fixed circuit board. This segmentation allows each probe to optimize its contact with corresponding chip contacts, maintaining structural simplicity while achieving reliable contact stability through localized adjustability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable electrical connections between chips and the testing apparatus, preventing incorrect classification of memory chips and improving the accuracy of memory testing results.
Implementation Method 1
at least one elastic assembly arranged in the accommodating slot, wherein one end of the at least one elastic assembly is fixed to the lift structure, and the other end of the at least one elastic assembly is fixed to the supporting structure, and the at least one elastic assembly is configured to be pressed to generate a return force
Data Source
AI summary
A testing apparatus includes a pressing device and a chip carrying device. The chip carrying device includes a circuit board and a plurality of electrically connecting units. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure, a supporting structure, an elastic assembly sandwiched between the lift structure and the supporting structure, and a plurality of probe assemblies, the latter four of which are arranged in the accommodating slot. The lift structure has a chip receiving slot for receiving a chip. When the chip receiving slot receives the chip and the lift structure is not pressed, the probe assemblies are not connected to the chip. When the chip receiving slot receives the chip and the lift structure is pressed by the pressing device to move toward the accommodating slot, the probe assemblies are connected to the chip.