Probe System Configurable Cover Plate Test Chamber
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Solution Overview
Problem
Existing analytical wafer probing systems are inadequate for conducting mission mode testing of packaged electronic devices, as they cannot accommodate the complexity of application or test boards with attached cabling, support electronics, provide sufficient probe positioning range, or maintain controlled temperatures, limiting their utility and capability.
Innovation Solution
A probe system with a test chamber and configurable cover plate, height-adjustable framework, and temperature-controlled air, allowing probes to be moved to any position on a packaged electronic device or its application board, while supporting the board and its cabling, and enabling testing at various temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If analytical wafer probing systems are used for packaged devices, then electrical testing capability is maintained, but probe positioning range and adaptability to complex board configurations are insufficient
Solution Approach 1:
The patent implements a height-adjustable framework that allows dynamic reconfiguration of the probe system to accommodate different board configurations and component heights. The framework can be adjusted vertically to reach tall components while maintaining stable support, transforming a static system into a dynamic one that adapts to various testing scenarios.
Solution Approach 2:
The system divides the probing function into separate modular components: the framework structure, the probe manipulator, and the probe itself. This segmentation allows each component to be optimized independently - the framework provides positioning range, the manipulator provides precision, and the probe provides electrical contact capability.
2Temperature
If wafer probing systems are used for mission mode testing, then basic electrical testing is possible, but thermal control capability is insufficient
Solution Approach 1:
The patent introduces a temperature-controlled chamber as an intermediary environment between the probe system and the packaged device. This chamber provides controlled thermal conditions for mission mode testing while allowing the existing probe system to maintain its electrical testing functionality, thus bridging the gap between basic testing and comprehensive mission mode testing.
3Adaptability or versatility
If probes are positioned on tall components, then comprehensive device testing is enabled, but probe contact stability deteriorates
Solution Approach 1:
The height-adjustable framework allows the probe system to dynamically adapt its height to match the component being tested. By adjusting the framework height rather than extending probe length, the system maintains optimal probe contact stability while accessing tall components, resolving the contradiction between accessibility and stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables full mission mode testing of packaged electronic devices with improved probe positioning, thermal control, and stability, allowing for precise electrical testing without disturbing interface cabling and maintaining good contact, even with tall components and complex board configurations.
Implementation Method 1
The test chamber may be provided with temperature controlled air to facilitate testing at different temperatures
Data Source
AI summary
Apparatus for facilitating analytical probing of a packaged electronic device is provided. The device may provide a test chamber that holds the device to be tested and provides an elevated or reduced temperature environment to conduct testing of the device at end-use application temperature levels. The apparatus includes a test chamber having perimeter walls and a configurable cover. The cover includes an adjustable position probe entry port or aperture that may be positioned to provide probe access to any point within the test chamber, and may comprise a cover with such positionable port or a plurality of overlapping plates such as a first plate with a cutout quadrant that can be oriented to expose any quadrant of the test chamber and a second plate with at least one probe entry port that can be situated in the cutout to provide the probe entry port above a desired test area of the electronic device. A height adjustable framework supported above the test chamber allows a probe manipulator to be brought into a required position to operate a probe through the probe entry port of the test chamber and into contact with the packaged electronics. A microscope is positionable above the probe manipulator to assist in placement of the probe. The apparatus is designed so that temperature controlled air may be provided to the test chamber to facilitate testing at elevated or reduced temperatures.