Probe Tip Position Correction for Thermal Expansion in Chip Inspection
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Solution Overview
Problem
Conventional probe apparatuses face inefficiencies and reliability issues during high-temperature and low-temperature inspections due to thermal expansion of probe cards, leading to misalignment and potential damage to probes and target objects, as they require preheating or cooling and struggle to maintain precise contact.
Innovation Solution
An inspecting method that registers and corrects the tip positions of probes based on contact time with a target object at a predetermined temperature, allowing for stable inspection without preheating or cooling the probe card, thereby maintaining accurate alignment and reducing overdrive pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the target object is heated to high temperature for inspection, then the electrical characteristics at high temperature can be measured, but the probe card and probes experience thermal expansion causing misalignment and potential damage
Solution Approach 1:
The probe card is preheated to the inspection temperature before the target object is brought into contact with the probes. This preliminary thermal treatment prevents thermal expansion during inspection, maintaining precise alignment between probes and electrode pads throughout the measurement process
Solution Approach 2:
The conventional method of gradually heating the target object during inspection is replaced by rapidly preheating the probe card before contact. This rushes through the thermal equilibrium process in advance, eliminating gradual thermal expansion that would cause alignment drift during measurement
2Manufacturing precision
If the probe card is preheated before inspection, then alignment precision is maintained, but the inspection time is increased due to the preheating process
Solution Approach 1:
The probe card is preheated to the inspection temperature before the target object is brought into contact with the probes. This preliminary thermal treatment prevents thermal expansion during inspection, maintaining precise alignment between probes and electrode pads throughout the measurement process
Solution Approach 2:
The conventional method of gradually heating the target object during inspection is replaced by rapidly preheating the probe card before contact. This rushes through the thermal equilibrium process in advance, eliminating gradual thermal expansion that would cause alignment drift during measurement
3Productivity
If the probes are brought into contact with the target object without preheating the probe card, then the inspection can start immediately, but the probes experience thermal expansion causing misalignment and potential damage
Solution Approach 1:
The probe card is preheated to the inspection temperature before the target object is brought into contact with the probes. This preliminary thermal treatment prevents thermal expansion during inspection, maintaining precise alignment between probes and electrode pads throughout the measurement process
Solution Approach 2:
The conventional method of gradually heating the target object during inspection is replaced by rapidly preheating the probe card before contact. This rushes through the thermal equilibrium process in advance, eliminating gradual thermal expansion that would cause alignment drift during measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances operating efficiency and reliability by preventing misalignment and damage, allowing for precise electrical characteristic inspections without preheating or cooling the probe card, thus improving the overall inspection process.
Implementation Method 1
the probes are heated by the target object and thus are extended by thermal expansion. Further, a main body of probe card is gradually heated by the heat transferred from the target object
Implementation Method 2
the probes are heated by the target object and thus are extended by thermal expansion. Further, a main body of probe card is gradually heated by the heat transferred from the target object to be thermally expanded
Data Source
AI summary
An inspecting method includes registering a pre-obtained relationship between contact time of probes with a target object having a predetermined temperature and tip positions of the probes which vary in accordance with the contact time. The method further includes inspecting one or more chips at a time by estimating the tip positions of the probes based on the relationship and the contact time of the probes with the one or more chips and then correcting the tip positions of the probes from previous tip positions based on the estimated tip positions until the probes are stable without being extended or contracted.


