Probe Tip Position Detection Using Connection Pads
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Solution Overview
Problem
The precise alignment of probe tips with contact pads on semiconductor chips is challenging due to mechanical drift, requiring a method to detect and correct deviations in position for effective contact during testing and manufacturing processes.
Innovation Solution
A semiconductor substrate with a detector arrangement of strategically arranged connection pads and circuits that allow for the detection of probe tip position deviations, enabling realignment by measuring specific voltage or current values at a common node, allowing for precise re-alignment of the probe tip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual alignment methods are used to position probe tips with contact pads, then operational flexibility is maintained, but alignment precision deteriorates due to mechanical drift
Solution Approach 1:
The patent replaces manual mechanical alignment operations with an automated electrical detection system. Connection pads with detector arrangements automatically sense probe tip positions through electrical measurements, eliminating the need for manual visual alignment and compensating for mechanical drift in the positioning system.
Solution Approach 2:
The system performs self-alignment through automated detection. The connection pads and detector arrangement automatically detect probe tip positions and provide feedback for correction without requiring manual intervention, enabling the system to self-correct alignment deviations caused by mechanical drift.
2Reliability
If probe tip position is not precisely detected, then operational simplicity is maintained, but contact reliability deteriorates
Solution Approach 1:
The connection pads serve multiple functions: they provide electrical connections for device operation and simultaneously function as detection elements for probe tip positioning. This multi-functionality integrates the detection capability into existing structure without adding separate complex detection hardware.
Solution Approach 2:
The patent merges the connection function and detection function into a single integrated structure. The connection pads are combined with detector arrangements that use the same electrical pathways to both operate the device and detect probe tip position, reducing overall system complexity.
3Productivity
If connection pads are made smaller to increase chip density, then productivity is improved, but measurement precision deteriorates due to reduced detection area
Solution Approach 1:
The detector arrangement uses non-uniform distribution of connection pads with varying sizes and spacing. Certain pads are strategically designed with specific dimensions and positions to optimize detection sensitivity in critical areas, allowing precise position detection even with overall small pad sizes for high density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient re-alignment of probe tips with contact pads, ensuring reliable electrical contact and reducing the need for manual adjustments, thereby improving the precision and efficiency of semiconductor chip testing and manufacturing.
Implementation Method 1
A current is passed through the connection element and one or more of the first connection pads, and a current value or a voltage value is measured in a first circuit connected to the first connection pads
Data Source
AI summary
A semiconductor and method is disclosed. One embodiment includes a detector arrangement to detect the position of a connection element. A probe tip, the detector arrangement including first connection pads are arranged on a substrate surface. A first circuit is connected to the first connection pads.