Probe Tip Conical Regeneration Using Ultrasonic Abrasive Gel
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Solution Overview
Problem
Conventional methods for regenerating the conical shape of probe tips used in semiconductor electrical tests, such as chemical etching and mechanical etching with abrasive cleaning gel, are inefficient and environmentally problematic, especially when dealing with rare metals like rhodium and iridium, and require excessive time and effort.
Innovation Solution
An ultrasonic vibration-based method using an abrasive cleaning gel film or viscous fluid with fine abrasive grains is employed, where the probe tip is penetrated and pulled up at a constant speed to efficiently form and restore the conical shape, significantly increasing the speed of mechanical etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chemical etching method is used to regenerate conical shape, then probe tip can be restored, but it cannot be applied to rare metals like rhodium and iridium which do not react with corrosive liquid
Solution Approach 1:
The patent replaces chemical etching with mechanical etching using an ultrasonic cleaner with abrasive cleaning gel. The ultrasonic vibration mechanically removes oxide films and restores conical shapes through physical abrasion rather than chemical reaction, making it applicable to rare metals like rhodium and iridium that do not react with chemical etchants.
2Adaptability or versatility
If mechanical etching with abrasive cleaning gel is used, then it can be applied to rare metals, but the time required for shape regeneration is very long
Solution Approach 1:
The patent employs ultrasonic vibration (mechanical vibration) to accelerate the mechanical etching process. The ultrasonic cleaner generates high-frequency vibrations that intensify the abrasive action of the cleaning gel, dramatically reducing the time required to restore probe tip conical shapes while maintaining effectiveness on rare metals.
3Ease of operation
If chemical etchants are used in semiconductor manufacturing plants, then probe tips can be cleaned, but cleaning and drying are troublesome and vapors contaminate the air
Solution Approach 1:
The patent replaces chemical etchants with a mechanical cleaning system using ultrasonic vibration and abrasive cleaning gel. This substitution eliminates harmful chemical vapors and simplifies the cleaning process to merely rinsing with water, removing the troublesome cleaning and drying steps associated with chemical methods while maintaining effective probe tip cleaning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces downtime for expensive probers, shortens cleaning time, and enhances the efficiency of probe tip regeneration, making it suitable for high-speed semiconductor production while minimizing environmental impact.
Implementation Method 1
an abrasive cleaning gel film having an abrasive cleaning gel layer and being configured to be stuck to a surface is adhered to a vibrating surface of an ultrasonic transducer and is ultrasonically vibrated
Implementation Method 2
an abrasive cleaning gel 60 is composed of a fluid 62 which is in the form of a gel with abrasive grains 61 held densely
Data Source
AI summary
Under the conditions that an abrasive cleaning gel film having an abrasive cleaning gel layer and being configured to be stuck to a surface or a container filled with a viscous fluid or a gel fluid in which fine abrasive grains are mixed and dispersed is attached to a vibrating surface of an ultrasonic transducer, and an axial direction of a probe for test is matched with a vibrating direction of the ultrasonic transducer, a tip of the probe is penetrated to a predetermined depth in the abrasive cleaning gel layer or the viscous fluid in which the fine abrasive grains are mixed and dispersed at a constant speed and then pulled up at a constant speed, whereby the tip of the probe can be formed into a conical shape.