Probe Implanting with Controlled Vibration for Socket Alignment
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Solution Overview
Problem
Existing probe implanting equipment faces issues such as probe sticking and deviation during the implantation process, leading to increased manpower and time requirements for troubleshooting, which hampers the efficiency of semiconductor testing operations.
Innovation Solution
A probe implanting equipment equipped with a vibration device and controller that provides controlled vibrations based on probe length and diameter to facilitate precise placement of probes into test sockets, using air blowing and throwing mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated probe implanting equipment is used to improve testing speed, then productivity increases, but probe stuck and implanted probe deviation occur more frequently
Solution Approach 1:
The patent applies mechanical vibration through a vibration device that generates vertical oscillations during probe implantation. The vibration frequency and amplitude are controlled to match the resonance characteristics of the probe-test socket system, enabling probes to overcome friction and misalignment forces, thereby preventing probe stuck and deviation while maintaining high-speed automated implantation.
2Manufacturing precision
If manual probe implantation is performed to ensure quality, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The vibration device enables the probe implantation system to self-correct deviations and overcome resistance during the implantation process. The controlled vibrations allow probes to automatically find their correct positions in the test socket and adjust for minor misalignments, eliminating the need for manual intervention while maintaining high precision.
3Manufacturing precision
If more control parameters are added to the vibration device, then probe implantation precision improves, but device complexity increases
Solution Approach 1:
The patent implements a vibration controller that adjusts key parameters including vibration frequency, amplitude, and duration based on probe characteristics and implantation requirements. These parameter changes enable precise control over the probe implantation process, allowing optimization of positioning accuracy while managing system complexity through focused parameter control rather than comprehensive system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate and automated probe implantation, reducing manual intervention and minimizing defects like probe sticking and deviation, thereby enhancing the efficiency and automation of semiconductor testing.
Implementation Method 1
a vibration device disposed on the base
Implementation Method 2
the mouthpiece configuration provides the plurality of probes to the plurality of positioning holes of the test socket by air blowing and probe throwing
Data Source
AI summary
A probe implanting equipment including: a base; a test socket disposed on the base and having a plurality of positioning holes; a mouthpiece configuration configured for providing a plurality of probes to the plurality of positioning holes; and a vibration device disposed on the base for effectively positioning the probes in the positioning holes of the test socket via vibration.