Prober Cleaning Block Assembly with Adjustable Leveling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional probe cleaning systems in wafer probing machines are inefficient, often leading to contamination of probe needle tips, which affects the accuracy of semiconductor chip testing, and require significant downtime for cleaning, interfering with adjacent mechanical components and prolonging processing times.
Innovation Solution
A system comprising a base plate with adjustable attachment means and a cleaning plate with a top area designed for leveling, allowing efficient and safe cleaning of large probe arrays without interfering with the probe machine's components, utilizing a cleaning film or tungsten carbide layer, and enabling in-situ cleaning adjacent to the wafer chuck to reduce contact resistance and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional probe cleaning systems are used, then probe needle tips can be cleaned, but cleaning requires significant downtime and interferes with adjacent mechanical components
Solution Approach 1:
The cleaning system is merged with the wafer probing machine by mounting the cleaning plate adjacent to the wafer chuck, allowing cleaning operations to be performed within the existing machine footprint without requiring separate cleaning equipment or additional downtime
Solution Approach 2:
The cleaning plate is made adjustable and movable relative to the probe needles, allowing dynamic positioning during cleaning operations. The adjustable attachment means enable the cleaning plate to be positioned at optimal locations for different probe arrays, facilitating efficient in-situ cleaning without interference with mechanical components
2Ease of manufacture
If probe arrays are cleaned irregularly, then cleaning may be simpler, but probe needle tips do not contact chips properly and test results are influenced
Solution Approach 1:
The cleaning plate incorporates adjustable attachment means that allow precise positioning and leveling adjustments. This dynamic adjustability ensures that the cleaning plate can be positioned at the correct height and orientation to properly contact all probe needles in large arrays, maintaining test accuracy while enabling comprehensive cleaning
Solution Approach 2:
The cleaning plate provides different cleaning surfaces or regions that can be selectively positioned to contact different areas of the probe array. This local customization of cleaning contact ensures that each probe needle receives appropriate cleaning pressure and angle, maintaining both cleaning effectiveness and probe alignment for accurate testing
3Area of stationary object
If cleaning systems are designed to fit within available space, then they physically fit in probe machines, but cleaning efficiency is reduced
Solution Approach 1:
The cleaning system is integrated into the existing wafer probing machine structure by mounting the cleaning plate adjacent to the wafer chuck. This merging of functions allows the cleaning system to utilize the existing machine footprint without requiring additional space, while still providing efficient cleaning capability for large probe arrays
Solution Approach 2:
The cleaning plate is positioned in a spatial arrangement that utilizes the vertical and lateral dimensions efficiently. By placing the cleaning plate adjacent to the wafer chuck and using adjustable attachment means, the system maximizes the use of available three-dimensional space within the probe machine, achieving both compact footprint and cleaning efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cleans large probe arrays, maintaining proper contact levels, reducing probe contact resistance, and enhancing die yields by allowing for faster processing times without increasing test duration, thus improving the reliability and efficiency of semiconductor chip testing.
Implementation Method 1
The probe needles are rubbed against the cleaning surface to remove debris therefrom
Implementation Method 2
a cleaning plate (100) with a top area (140) for cleaning probe contacts wherein the top area is between 60-100 mm times 75-100 mm
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A system is provided for cleaning of probe contacts. The system includes a base plate comprising three mounting means for receiving each an adjustable attachment means, and means for connecting the base plate to a probe machine; and a cleaning plate comprising three holding means for receiving the respective adjustable attachment means, and a top area for cleaning probe contacts. The top area is between 60-100 mm times 75-100 mm, and the adjustable attachment means allows the cleaning plate to be leveled. A method for mounting in a probe machine such a system for cleaning of probe contacts is provided. The method includes connecting the base plate in the probe machine; connecting the cleaning plate to the base plate with the adjustable attachment means by mounting one of the adjustable attachment means as a reference, and mounting the two other adjustable attachment means for adjusting the level of the cleaning plate; and leveling the cleaning plate with the aid of measuring means for measuring distance held by the probe machine. The leveling includes repeating the following steps until the desired level is reached: moving the measuring means to a place on the cleaning plate top area that is substantially above the adjustable attachment means used as a reference and measure a reference value with the measuring means; moving the measuring means to a place on the cleaning plate top area that is substantially above one of the two adjustable attachment means for adjusting the level and adjust that attachment means until the measuring means reads substantially the same as the reference value; and moving the measuring means to a place on the cleaning plate top area that is substantially above the other of the two adjustable attachment means for adjusting the level and adjust that attachment means until the measuring means reads substantially the same as the reference value.