Prober Cooling Unit Direct Thermal Coupling for Semiconductor Testing
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Solution Overview
Problem
Existing test systems for semiconductor chips face challenges in testing without damaging the devices due to heat generation during the testing process, particularly during burn-in procedures for power semiconductor chips, where conventional cooling methods are inadequate for high thermal power applications.
Innovation Solution
A prober with a direct cooling unit is introduced, featuring a chuck and transport circuitry for electric signals, and a cooling unit thermally coupled with the device under test to efficiently remove heat from the main surface facing the chuck, allowing for effective thermal management and preventing damage during testing and burn-in.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling methods are used during testing, then the testing process can proceed, but the device under test may be damaged by excessive heat generation
Solution Approach 1:
The patent introduces a cooling plate as an intermediary component between the device under test and the heat source. This cooling plate acts as a thermal mediator that conducts heat away from the device while allowing electrical contacts to pass through it, thus resolving the contradiction between maintaining device integrity and managing heat generation during testing
Solution Approach 2:
The patent combines multiple functions into the cooling plate: it serves as both a thermal management component (cooling the device) and an electrical contact component (allowing probe contacts to pass through). This merging of cooling and electrical connection functions enables effective heat removal without compromising the electrical testing capability
2Reliability
If test signals are applied to semiconductor chips during testing, then functionality can be verified, but considerable heat is generated that may deteriorate or destroy the device
Solution Approach 1:
The patent implements preliminary cooling action by positioning the cooling plate in direct thermal contact with the device under test before the actual testing begins. This pre-established thermal pathway ensures that heat is continuously removed during the entire testing process, preventing heat accumulation that could damage the device while allowing accurate functionality verification
3Loss of energy
If direct thermal coupling is implemented for cooling, then heat removal efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling plate is designed to perform multiple functions simultaneously: it provides thermal management by conducting heat away from the device, serves as a mechanical support structure, and allows electrical probe contacts to pass through it to reach the device. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while maintaining high heat removal efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and safe testing of semiconductor chips, particularly during high-power applications, by efficiently removing heat and supporting parallelized testing and burn-in procedures, ensuring the devices are not damaged by excessive heat.
Implementation Method 1
a cooling unit directly thermally coupled with the device under test and configured for cooling the device under test at a main surface of the device under test facing the chuck
Data Source
AI summary
Prober for a test system for testing a device under test is disclosed. In one example, the prober comprises a chuck configured for carrying the device under test, a transport circuitry for transporting electric signals to and/or away from the device under test. A cooling unit is directly thermally coupled with the device under test and configured for cooling the device under test at a main surface of the device under test facing the chuck.