Prober Thermal Management via Gas Flow and Segmented Housing
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Solution Overview
Problem
Probers used for verifying semiconductor components face challenges in maintaining precise positioning and preventing thermal interference, especially at high temperatures, due to heat exchange through the probe mounting plate and contact with the test substrate, which affects measurement accuracy and safety.
Innovation Solution
A prober design with a temperature-regulated gas flow system in the probe chamber, independent of the test substrate temperature, to maintain stable conditions for probes and signal conditioning components, using gas inlets and outlets to control temperature and minimize thermal expansion and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the probe chamber is thermally isolated to maintain stable probe temperature, then measurement precision is improved, but heat dissipation from the test substrate becomes problematic
Solution Approach 1:
The housing is divided into two separate chambers: a test substrate chamber and a probe chamber. This segmentation allows independent thermal management of each chamber, enabling the probe chamber to maintain stable temperature for precise measurements while the test substrate chamber can be heated to required test temperatures without directly affecting the probes.
Solution Approach 2:
A thermally conductive plate is introduced as an intermediary between the test substrate chamber and probe chamber. This plate facilitates controlled heat transfer from the heated test substrate to the probe chamber, allowing the probe chamber temperature to be regulated independently while still permitting necessary thermal conditions for both chambers.
2Object-affected harmful factors
If thick-walled ferromagnetic housing is used for low-frequency magnetic shielding, then shielding effectiveness is improved, but accessibility to internal components deteriorates
Solution Approach 1:
The housing is segmented into multiple accessible sections with removable panels or doors that provide access to internal components such as the positioning units and chuck. These access points are designed to minimize interruptions in the electromagnetic shielding while allowing easy maintenance and operation of internal components.
Solution Approach 2:
The positioning units and other operational components are nested within the shielded housing structure, allowing them to be accessed through designated openings or removable sections without compromising the overall shielding effectiveness. The nested design enables component access while maintaining the protective envelope.
3Stability of the object's composition
If the probe chamber temperature is independent of test substrate temperature, then probe stability is improved, but system complexity increases
Solution Approach 1:
The system utilizes the thermal energy from the heated test substrate itself to maintain the probe chamber temperature through the thermally conductive plate. This self-service approach reduces the need for additional active heating or cooling systems in the probe chamber, thereby limiting the increase in system complexity while achieving independent temperature control.
Solution Approach 2:
The system changes the thermal parameters by introducing a thermally conductive plate with specific thermal conductivity properties that enable controlled heat transfer. This parameter change allows the probe chamber to achieve thermal stability independent of test substrate temperature variations without requiring complex active temperature regulation systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise and long-term testing by maintaining the probes and signal conditioning components at a stable temperature, reducing thermal drift and preventing overheating, thus ensuring accurate measurements and component safety.
Implementation Method 1
a gas flow (11) running through the probe chamber (3) is regulated in such a way that a temperature in the probe chamber (3) is set which is independent of a temperature of the test substrate (7)
Implementation Method 2
The probe chamber (3) is thermally isolated from the test substrate chamber (2) by means of thermal insulation (27)
Implementation Method 3
a plate (4) which upwardly delimits the test substrate chamber (2) and in which a central opening (26) is arranged... the plate (4) being embodied in a thermally conductive manner
Data Source
AI summary
A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.