Probing Apparatus On-Probe Device Mapping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor device inspection apparatuses require two imaging systems and precise optical center alignment, leading to inefficiencies in device mapping and probing due to probe obstruction and increased travel distances for the positioning stage.
Innovation Solution
A probing apparatus with an on-probe device-mapping function that moves the probe out of focus of the optical inspection module while keeping the device under test in the field of view, utilizing a driving unit to position the probe stage and inspection module along the Z-axis, allowing for transparent imaging and synchronous movement during the mapping phase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a second imaging system is used for device mapping, then complete mapping of semiconductor devices can be achieved, but device complexity and alignment precision requirements increase
Solution Approach 1:
The probe is extracted from the in-focus plane and moved to the out-of-focus plane during the mapping phase. This separation allows the optical inspection module to capture complete device images without probe obstruction, eliminating the need for a second imaging system while maintaining mapping completeness
Solution Approach 2:
The probe position is dynamically adjusted between in-focus and out-of-focus states depending on the operational phase. During mapping, the probe is positioned out of focus to avoid blocking; during probing, it is positioned in focus to contact the device. This dynamic positioning resolves the contradiction between complete mapping and probe obstruction
2Reliability
If the probe is positioned in focus for probing, then accurate electrical contact can be made, but the probe blocks the optical inspection module's view during mapping
Solution Approach 1:
The probe's axial position is dynamically changed based on operational requirements. During device mapping, the probe is retracted to the out-of-focus plane, allowing unobstructed optical imaging. During electrical probing, the probe is advanced to the in-focus plane to establish accurate contact. This dynamic positioning eliminates image blocking while preserving probing reliability
Solution Approach 2:
Before the probing operation, the system performs device mapping with the probe positioned out of focus to capture complete device images. This preliminary action of positioning the probe out of focus before mapping prevents image blocking, and the probe is subsequently positioned in focus for accurate electrical contact
3Measurement precision
If the semiconductor device positioning stage moves between two imaging systems, then device mapping can be performed, but positioning time and travel distance increase
Solution Approach 1:
The mapping function and probing function are merged into a single optical inspection module. By combining both functions into one system and using dynamic probe positioning, the semiconductor device positioning stage remains stationary, eliminating the time-consuming movements between separate imaging systems while maintaining mapping accuracy
Solution Approach 2:
The single optical inspection module is designed to perform multiple functions: device mapping and optical probing. The probe can be positioned out of focus for mapping and in focus for probing, allowing one imaging system to replace two. This multi-functionality eliminates the need for the positioning stage to travel between separate imaging systems, reducing positioning time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient device mapping and probing by eliminating the need for a second imaging system and reducing alignment complexities, improving positioning accuracy and reducing travel distances, thus enhancing the inspection process.
Implementation Method 1
moving the probe out of focus of the optical inspection module while keeping the device under test in the field of view
Data Source
AI summary
One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.