Probing Apparatus Platen Temperature Control for Thermal Expansion

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Solution Overview

Problem

The existing probing apparatuses for semiconductor devices face challenges in maintaining temperature uniformity during electrical testing, leading to physical dimension changes in the platen and probe units due to thermal expansion, which disrupts probe alignment and increases testing time and cost.

Innovation Solution

A probing apparatus that uses pressurized fluid flow lines within the platen to control temperature uniformity, preventing local thermal expansion and maintaining stable probe positions during device movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the device holder moves the wafer under test to probe different devices or pads, then the electrical testing can be performed on multiple devices, but the temperature distribution of the testing environment changes, leading to physical dimension changes of the platen and probe card, which alters the relative positions of the probes against the contact area

Engineering Contradiction:

Improveability to test multiple devicesVSAvoidprobe alignment precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by implementing temperature control specifically in the platen region where probes are positioned. The platen is equipped with heating elements and cooling channels that allow independent temperature adjustment of this critical area, ensuring that while the device holder moves to test multiple devices, the platen and probe card maintain stable dimensions and probe alignment is preserved.

Inventive Principle:

Principle #3Local quality

2Temperature

If the testing environment temperature is increased to meet test requirements, then the electrical characteristics can be tested under higher temperature conditions, but the time required for the test system to stabilize increases

Engineering Contradiction:

Improvetest temperature rangeVSAvoidstabilization time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-heating or pre-cooling the platen and probe card assembly before the actual testing begins. The temperature control system activates in advance to bring these components to the target test temperature, so that when testing commences, the system is already stabilized and no additional stabilization time is required during the test sequence.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies dynamics by implementing a dynamic temperature control system that can rapidly adjust temperatures of the platen and probe card. The system uses feedback from temperature sensors and actively modulates heating elements and cooling flow to achieve quick thermal equilibrium, reducing stabilization time while maintaining the required test temperature range.

Inventive Principle:

Principle #15Dynamics

3Temperature

If the probe card and platen are heated to match the device temperature, then thermal expansion occurs in these components, but this causes deformation and shrinkage that alters the relative positions of the probes

Engineering Contradiction:

Improvethermal equilibriumVSAvoidphysical dimension stability

Core Design Contradiction:

TemperatureVSShape

Solution Approach 1:

The patent applies local quality by differentiating temperature control between different components. The platen is heated to match the device temperature for thermal equilibrium, while the probe card is maintained at a separate, stable temperature through its own temperature control mechanism. This prevents the probe card from undergoing thermal expansion that would alter probe positions, while still allowing the platen to be thermally matched to the device.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures accurate and uninterrupted electrical testing by maintaining stable relative positions of probes and probe cards, reducing the need for repeated stabilization and alignment, thus enhancing testing efficiency and reducing costs.

Implementation Method 1

at least one flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen

Methodology Applied

Scientific EffectFluid flow:

Implementation Method 2

reduce the influence of the local thermal expansion of the platen due to the local temperature variation

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

a temperature-controller positioned in the device holder and configured to control the temperature of the device holder

Methodology Applied

Scientific EffectTemperature control:

Data Source

PatentUS8035405B2Semiconductor devices testing apparatus with temperature-adjusting design

Publication Date: 2011.10.11 VUETTE PTE LTD

AI summary

A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.