Probing Tip with Non-Conductive Substrate for 30 GHz Bandwidth
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Solution Overview
Problem
The existing signal acquisition probes face limitations in achieving high bandwidth due to capacitive and inductive effects of metal probing tips, making it difficult to design probes with bandwidths greater than 5 GHz.
Innovation Solution
A non-conductive substrate with a contoured probing tip contact and integrated resistive and amplifier elements, where the resistive element is coupled to the probing tip and the amplifier, and secured to a carrier with a grounded coplanar waveguide structure, using materials like titanium-tungsten alloy and gold for enhanced conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal probing tips are used for signal acquisition, then electrical conductivity is improved, but capacitive and inductive effects increase limiting bandwidth to 5 GHz and below
Solution Approach 1:
The patent extracts the harmful metal material from the probing tip and replaces it with a non-conductive substrate. This removes the source of capacitive and inductive effects while maintaining electrical conductivity through alternative means (conductive adhesive or wire bond connection to trace), thereby enabling bandwidths greater than 5 GHz
Solution Approach 2:
The patent employs composite construction by combining non-conductive substrate material with conductive elements (conductive adhesive, wire bonds, metal traces). This composite approach eliminates the harmful properties of solid metal tips while preserving necessary electrical conductivity, achieving bandwidths up to 30 GHz
2Adaptability or versatility
If the probing tip is separated from the probe amplifier unit, then adaptability for difficult to reach contacts is improved, but device complexity increases with separate probe tip unit and probe cable
Solution Approach 1:
The patent divides the probe system into separable components: a probe tip unit containing the non-conductive substrate and circuitry, and a probe amplifier unit. They connect via coaxial cables, allowing the smaller probe tip unit to reach difficult contacts while the larger amplifier unit remains accessible for operation and maintenance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for higher bandwidth signal acquisition by reducing capacitive effects and achieving bandwidths up to 30 GHz by minimizing loading on the device under test and optimizing signal conditioning.
Implementation Method 1
electrically conductive material deposited thereon
Implementation Method 2
A resistive element is disposed on one of the opposing horizontal surfaces of the non-conductive substrate
Data Source
AI summary
A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.