Process Chamber Cleaning Cycles Using NH and Fluorine Gases

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Solution Overview

Problem

Existing semiconductor manufacturing processes face challenges in effectively cleaning the interior of process containers after substrate processing, leading to residue buildup.

Innovation Solution

A cleaning method involving alternating cycles of nitrogen- and hydrogen-containing gases and fluorine-containing gases is employed to remove adhering substances from the process container, enhancing cleaning efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional cleaning methods are used to remove substances adhering to the process container interior, then cleaning is performed, but cleaning efficiency is low and cleaning time is prolonged

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidcleaning time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The cleaning process uses periodic cyclic action by alternating between nitrogen-hydrogen gas supply and fluorine gas supply multiple times. This periodic cleaning cycle achieves superior cleaning efficiency compared to conventional single-step methods, while the optimized cycle structure prevents excessive time consumption.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The invention changes multiple parameters including gas composition (nitrogen-hydrogen mixture followed by fluorine gas), temperature (maintained at 20-400°C), and pressure (1-760 Torr) to optimize the cleaning process. These parameter changes enable efficient removal of adhering substances while controlling cleaning time.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If conventional cleaning methods are used, then cleaning is performed, but the amount of cleaning gas required is large

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidcleaning gas consumption

Core Design Contradiction:

ProductivityVSQuantity of substance

Solution Approach 1:

The cleaning process uses partial action by performing a predetermined number of cycles (1-10 times) rather than continuous cleaning. Each cycle uses fluorine gas only when necessary (after nitrogen-hydrogen gas preparation), reducing overall gas consumption while maintaining effective cleaning performance.

Inventive Principle:

Principle #16Partial or excessive action

Solution Approach 2:

Nitrogen-hydrogen gas acts as an intermediary that prepares the environment before fluorine gas is introduced. This intermediary step optimizes the conditions for fluorine gas to work more efficiently, reducing the total amount of fluorine gas needed while improving cleaning effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If cleaning is performed to remove adhering substances, then productivity is improved, but cleaning time increases

Engineering Contradiction:

ImproveproductivityVSAvoidcleaning duration

Core Design Contradiction:

ProductivityVSDuration of action of moving object

Solution Approach 1:

The periodic cyclic cleaning structure with predetermined cycle numbers (1-10 times) achieves optimal balance between cleaning effectiveness and time consumption. The cycling between nitrogen-hydrogen gas supply and fluorine gas supply creates efficient cleaning intervals that improve productivity without excessive duration.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

Nitrogen-hydrogen gas supply serves as preliminary action that prepares the process container interior before fluorine gas is introduced. This preliminary preparation optimizes subsequent fluorine gas cleaning action, reducing the time needed for effective substance removal and improving overall productivity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively removes adhering substances by generating oxidizing species that break chemical bonds, resulting in improved cleaning efficacy and reduced residue.

Implementation Method 1

supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container... supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains

Methodology Applied

Scientific EffectChemical etching: Chemical Bonding

Data Source

PatentUS12618149B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Publication Date: 2026.05.05 KOKUSAI DENKI KK

AI summary

There is provided a technique that includes removing a substance adhering to the interior of the process container by performing a cycle a predetermined number of times under a first temperature, the cycle including: (a) supplying one gas of a nitrogen- and hydrogen-containing gas and a fluorine-containing gas into the process container after a substrate is processed; and (b) supplying the other gas different from the one gas of the nitrogen- and hydrogen-containing gas and the fluorine-containing gas into the process container where the one gas remains.