Process Chamber Purge Airflow for Cleaner Substrate Transfer
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Solution Overview
Problem
Foreign substances such as particles are introduced into the process chamber of a substrate processing apparatus when the gate moves, leading to contamination and damage of substrates during insertion or removal.
Innovation Solution
A substrate processing method and apparatus that utilize a purge gas supplied through a shower head, synchronized with the opening and closing of the gate, to create a downward airflow that prevents foreign substances from attaching to the substrate by maintaining a lower pressure inside the process chamber and discharging them through an exhaust port.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the gate moves to open or close for substrate transfer, then substrate insertion and removal is enabled, but foreign substances such as particles are introduced into the process chamber causing contamination
Solution Approach 1:
A downward airflow is generated in advance before the gate opens to prevent particles from attaching to the substrate during the subsequent gate opening and closing process. The airflow is established prior to the harmful event (particle introduction) to proactively protect the substrate.
Solution Approach 2:
A downward airflow is introduced as an intermediary between the gate movement and the substrate to prevent direct contact between particles and the substrate. This airflow acts as a protective medium that deflects particles away from the substrate surface during gate operation.
2Object-affected harmful factors
If the gate remains closed to prevent particle contamination, then substrate cleanliness is improved, but substrate transfer between chambers is hindered
Solution Approach 1:
The downward airflow is activated before the gate opens to create a protective environment, allowing the gate to open without compromising substrate cleanliness. This preliminary preparation enables both contamination prevention and efficient substrate transfer to occur simultaneously.
Solution Approach 2:
The pressure distribution and airflow parameters are modified by introducing a downward flow that maintains a pressure difference across the substrate surface. This parameter change creates a protective airflow pattern that allows gate operation while preventing particle attachment.
3Speed
If the substrate is exposed during gate movement, then transfer speed is improved, but particle attachment risk increases
Solution Approach 1:
A downward airflow serves as an intermediary protective field during substrate exposure and gate movement. This airflow continues during the transfer process, allowing fast gate operation while maintaining substrate protection from particles throughout the exposure period.
Solution Approach 2:
The downward airflow is established before substrate exposure occurs, creating a protective environment that persists throughout the entire gate movement and transfer process. This ensures continuous protection even during the vulnerable exposure phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the attachment of foreign substances to substrates, with a reduction of over 64% in particle contamination, as demonstrated by tests with a 300 mm substrate, ensuring cleaner processing and reduced damage.
Implementation Method 1
supplying a purge gas into the process chamber through a shower head of the process chamber
Implementation Method 2
exhausting gas inside the chamber to generate a downward airflow inside process chamber
Data Source
AI summary
Provided is a substrate processing apparatus and a substrate processing method, more particularly, a substrate processing apparatus and a substrate processing method that reduce attachment of foreign substances such as particles to a substrate when the substrate is inserted into a process chamber of the substrate processing apparatus or is drawn out of the process chamber.