Process Chamber Segmentation for Continuous Deposition and Cleaning
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Solution Overview
Problem
Existing semiconductor process chambers face inefficiencies in throughput due to the need for frequent cleaning, which increases downtime and production costs.
Innovation Solution
The process chamber design includes a substrate support assembly that can move to different positions, sealing off regions for separate operations, allowing simultaneous cooling of substrates and high-temperature cleaning, enabling substrate exchange during cleaning, and using materials with varying thermal conductivities to optimize temperature and gas flow control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the process chamber is cleaned frequently to improve deposition results, then the quality of deposition process is improved, but the throughput and productivity of the process chamber decreases
Solution Approach 1:
The process chamber is divided into two separate chambers: a first process chamber for performing depositions and a second process chamber for cleaning operations. This segmentation allows both deposition and cleaning to occur simultaneously in different chambers, eliminating the trade-off between deposition quality and throughput by enabling continuous operation without requiring substrate removal for cleaning.
2Stability of the object's composition
If the substrate support assembly is positioned close to the chamber wall to seal the volume, then the sealing effectiveness is improved, but the substrate cannot be cooled efficiently
Solution Approach 1:
The substrate support assembly is positioned away from the chamber wall in the horizontal dimension, creating a substrate support assembly cool zone between the substrate support assembly and the chamber wall. Cooling gases are directed into this zone to cool the substrate support assembly and substrate, while the chamber wall itself is cooled through its thickness from the exterior, providing dual-path cooling that maintains both sealing and thermal management.
3Reliability
If cleaning gases are introduced at high temperature to improve cleaning effectiveness, then the cleaning capability is improved, but the substrate may be damaged or require additional cooling time
Solution Approach 1:
The cleaning process is segmented into two temperature zones: a cleaning zone where high-temperature cleaning gases are introduced for effective cleaning, and a substrate support assembly cool zone where cooling gases are directed to cool the substrate support assembly and substrate. This spatial segmentation allows simultaneous high-temperature cleaning and cooling operations without compromising substrate integrity or requiring sequential processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances throughput by allowing continuous processing while cleaning, reduces downtime, and optimizes energy usage by maintaining target process temperatures quickly and efficiently.
Implementation Method 1
The substrate support assembly can be positioned against the chamber wall to seal the processing volume from the cleaning volume
Implementation Method 2
Cooling gases can be directed onto the substrate support assembly to cool the substrate support assembly and the substrate
Implementation Method 3
cleaning gases can be provided to the cleaning volume when the substrate support assembly is positioned in the cleaning position
Data Source
AI summary
A process chamber is provided including a chamber body enclosing an interior volume and a substrate support assembly in the interior volume. The substrate support assembly includes a substrate support having a substrate receiving surface, an upper plate, and a lower plate, the upper plate positioned over the substrate support. The substrate support is positioned over and spaced apart from the lower plate.