Process Chamber With Differential Wall Thickness For Supercritical Drying

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Solution Overview

Problem

Existing process chambers in semiconductor manufacturing face challenges in enduring high pressures during supercritical fluid drying processes, which requires robust structures to maintain efficiency and safety.

Innovation Solution

A compact process chamber design featuring multiple compartment spaces with strategically thinner partition walls and thicker outer walls, allowing for efficient fluid supply and exhaust while withstanding high pressures, and utilizing supercritical fluids for enhanced drying efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the process chamber uses a robust structure to endure high pressure from supercritical fluid, then the pressure resistance is improved, but the device complexity and size increase

Engineering Contradiction:
Improvepressure resistanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The housing employs different wall thicknesses in different locations: thicker outer walls for pressure resistance and thinner partition walls for compactness. This local differentiation allows the chamber to endure high pressure while maintaining a compact overall structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The process chamber is divided into multiple compartment spaces using partition walls. This segmentation allows for multi-functional processing while maintaining pressure containment through the thicker outer housing structure.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the process chamber is designed with multiple compartment spaces, then the processing efficiency is improved, but the structural complexity increases

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidstructural complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The process chamber is divided into multiple compartment spaces using partition walls, enabling simultaneous or sequential processing in different zones. This segmentation increases productivity while the unified housing structure keeps the overall design manageable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple compartment spaces within a single housing structure allow the process chamber to perform multiple processing functions (e.g., different chemical treatments, drying stages) in one device, improving processing efficiency without requiring separate chambers for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If the partition walls are made thinner to reduce size, then the compactness is improved, but the pressure resistance deteriorates

Engineering Contradiction:
Improvechamber sizeVSAvoidpressure resistance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

Different wall sections serve different functions: outer walls are made thick for pressure containment, while internal partition walls are made thinner for compactness. This local quality differentiation resolves the contradiction between size and pressure resistance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The design shifts the pressure-bearing function to the outer walls rather than relying on partition wall thickness. By changing which dimensional elements bear the pressure load, the partition walls can be thinner while maintaining overall pressure resistance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances processing efficiency and safety by effectively managing high pressures within the chamber, ensuring reliable operation and improved drying performance using supercritical fluids.

Implementation Method 1

a process chamber is supplied with a supercritical fluid to dry the cleaning solution remaining on the substrate

Methodology Applied
Scientific EffectSupercritical fluid drying: Supercritical Drying

Data Source

PatentUS11610788B2Process chamber and substrate processing apparatus including the same
Publication Date: 2023.03.21 SAMSUNG ELECTRONICS CO LTD
  • US11610788B2 patent drawing
  • US11610788B2 patent drawing
  • US11610788B2 patent drawing

AI summary

A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.