Process Kit Ring with Protrusions for Edge Plasma Uniformity
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Solution Overview
Problem
Conventional substrate processing systems face challenges in achieving uniform plasma processing due to discontinuities in RF power coupling at the edge of substrates, leading to edge roll off or roll up, which affects the uniformity of substrate treatment.
Innovation Solution
The implementation of a process kit ring with specific dimensions and protrusions, along with additional electrodes, improves RF energy coupling proximate the substrate edge, addressing discontinuities and enhancing plasma uniformity by providing controlled RF power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrate processing systems use standard RF power coupling, then the system structure remains simple, but plasma uniformity deteriorates due to edge roll off or roll up
Solution Approach 1:
The patent applies local quality by providing RF power independently to different regions of the substrate - specifically, edge regions receive different RF power levels than center regions. This is achieved through multiple electrodes (first electrode for center region, second electrode for edge region) that can be controlled independently, allowing localized optimization of plasma uniformity at the substrate edge where problems occur.
Solution Approach 2:
The patent segments the substrate processing area into distinct regions with separate RF control - a center region controlled by a first electrode and an edge region controlled by a second electrode. This segmentation allows independent optimization of RF power coupling in each region, specifically addressing the edge roll off or roll up problem by providing tailored power distribution to the edge region.
2Manufacturing precision
If additional electrodes are added to improve RF energy coupling at substrate edges, then plasma uniformity improves, but device complexity increases
Solution Approach 1:
The patent achieves multi-functionality by designing a substrate support structure where the first and second electrodes are integrated into the same support assembly. Both electrodes work together to provide comprehensive RF power distribution across the entire substrate surface, with the second electrode specifically addressing edge regions while the first electrode covers the center region, creating a unified system that handles multiple processing zones.
Solution Approach 2:
The patent employs a nested structure where the second electrode is positioned within or adjacent to the first electrode's coverage area. The electrodes are arranged concentrically or in overlapping configurations, with the second electrode focused on the edge region and the first electrode covering the broader center region, allowing compact integration of multiple functional zones within a single substrate support structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates more uniform plasma processing, reducing edge roll off or roll up and ensuring consistent treatment across the substrate, thereby improving the overall processing quality.
Implementation Method 1
use of radio frequency (RF) energy to control a plasma proximate the substrate, such as by coupling RF energy to an electrode disposed beneath a substrate disposed on a substrate support
Implementation Method 2
Substrate processing systems, such as plasma reactors, may be used to deposit, etch, or form layers on a substrate or otherwise treat surfaces of the substrate
Data Source
AI summary
Process kit components for use with a substrate support of a process chamber are provided herein. In some embodiments, a process kit ring may include a ring shaped body having an outer edge, an inner edge, a top surface and a bottom, wherein the outer edge has a diameter of about 12.473 inches to about 12.479 inches and the inner edge has a diameter of about 11.726 inches to about 11.728 inches, and wherein the ring shaped body has a height of about 0.116 to about 0.118 inches; and a plurality of protrusions disposed on the top surface of the ring shaped body, each of the plurality of protrusions disposed symmetrically about the ring shaped body.