Process Tube Cleaning With Sequential Chlorine and Fluorine Gases
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently removing deposited materials from their tubes, leading to increased cleaning time and residual byproducts.
Innovation Solution
A substrate processing apparatus and method that utilize a two-step cleaning process involving chlorine-based and fluorine-based gases to remove deposited materials, with the apparatus featuring a process tube, a boat for substrate support, and nozzles for gas supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single removal process is used to remove deposited material from the process tube, then the cleaning process is simple, but the cleaning time increases and residual byproducts remain
Solution Approach 1:
The cleaning process is divided into multiple sequential removal processes: a first removal process using a first gas to remove primary deposited material, followed by a second removal process using a second gas to remove secondary byproducts. This segmentation allows each gas to target specific types of deposits, improving overall cleaning efficiency and reducing total cleaning time compared to using a single removal process.
Solution Approach 2:
The invention changes the chemical parameters by using different types of gases for different removal stages. The first gas is selected from specific groups (halogen-based, oxygen-based, or nitrogen-based gases) for the first removal process, and the second gas is selected from different groups for the second removal process. This parameter variation enables effective removal of different types of deposited materials, achieving thorough cleaning while maintaining efficient processing speed.
2Productivity
If a two-step cleaning process with different gases is used, then cleaning efficiency improves, but the process complexity increases
Solution Approach 1:
The cleaning process is divided into multiple sequential removal processes: a first removal process using a first gas to remove primary deposited material, followed by a second removal process using a second gas to remove secondary byproducts. This segmentation allows each gas to target specific types of deposits, improving overall cleaning efficiency and reducing total cleaning time compared to using a single removal process.
Solution Approach 2:
The invention changes the chemical parameters by using different types of gases for different removal stages. The first gas is selected from specific groups (halogen-based, oxygen-based, or nitrogen-based gases) for the first removal process, and the second gas is selected from different groups for the second removal process. This parameter variation enables effective removal of different types of deposited materials, achieving thorough cleaning while maintaining efficient processing speed.
3Ease of operation
If manual intervention is used for cleaning, then the process is simple to monitor, but the cleaning time increases and thoroughness decreases
Solution Approach 1:
The cleaning system operates autonomously using automated gas supply and control mechanisms. The process tube receives sequentially different gases through automated delivery systems, and the removal processes are controlled by the apparatus itself without requiring manual intervention. This self-service approach maintains thorough cleaning while significantly reducing cleaning time and operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces cleaning time by efficiently removing both primary and secondary deposited materials, ensuring thorough cleaning of the process tube without manual intervention.
Implementation Method 1
removing, by performing a first removal process, a first material deposited in the process tube; and removing, by performing a second removal process, a second material deposited in the process tube by the first removal process, wherein the first removal process includes supplying the process tube with a first gas, wherein the second removal process includes supplying the process tube with a second gas, wherein one of the first gas and the second gas includes a chlorine-based gas
Implementation Method 2
wherein one of the first gas and the second gas includes a chlorine-based gas, and wherein the other of the first gas and the second gas includes a fluorine-based gas
Data Source
AI summary
A substrate processing apparatus cleaning method includes: inserting a boat into a process tube; removing, by performing a first removal process, a first material deposited in the process tube; and removing, by performing a second removal process, a second material deposited in the process tube by the first removal process, wherein the first removal process includes supplying the process tube with a first gas, wherein the second removal process includes supplying the process tube with a second gas, wherein one of the first gas and the second gas includes a chlorine-based gas, and wherein the other of the first gas and the second gas includes a fluorine-based gas.