Processed Filament Laser Ablation for Selective Metal Layer Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for preparing multilayer wires for electrochemical sensors face challenges in completely removing the outer metal layer without damaging the polymer layer, leading to non-uniform enzyme coating thicknesses and affecting signal-to-noise ratio and linearity, while maintaining a minimum wire diameter.
Innovation Solution
A process involving electromagnetic radiation with a specific wavelength range (430 to 780 nm) is used to selectively remove the outer metal layer from multilayer wires, ensuring minimal damage to the polymer layer and achieving precise thickness control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-precision laser ablation is used to completely remove the outer metal layer, then the outer metal layer is completely removed, but the polymer layer is damaged
Solution Approach 1:
The invention divides the outer metal layer into two functional parts: a first metal layer (e.g., silver) that is completely removed by laser ablation to create the sensor segment, and a second metal layer (e.g., gold) that remains as a protective layer during processing and is removed later. This segmentation allows complete removal of the conductive layer without exposing the polymer to damaging laser energies, as the second metal layer acts as a sacrificial protective barrier.
Solution Approach 2:
The second metal layer is applied in advance as a protective coating before the laser ablation process. This preliminary protective layer prevents direct laser interaction with the polymer, eliminating damage before it can occur. The second metal layer is subsequently removed by chemical etching or alternative laser parameters after the critical ablation is complete.
2Length of moving object
If the polymer layer thickness is reduced to minimize wire diameter, then miniaturization is achieved, but the polymer layer integrity is compromised
Solution Approach 1:
The dual metal layer structure allows the polymer layer to be made thinner for miniaturization while maintaining integrity. The second metal layer provides additional protection during processing, enabling the use of thinner polymer layers that would otherwise be vulnerable to damage during the ablation process.
3Ease of manufacture
If the outer metal layer is completely removed, then sensor preparation is enabled, but the polymer layer surface becomes non-uniform
Solution Approach 1:
By keeping the second metal layer intact during the ablation process, the polymer layer is never directly exposed to the laser beam. This prevents laser-induced surface structuring and maintains uniform surface properties, while still enabling complete removal of the first metal layer to create the necessary sensor geometry.
4Manufacturing precision
If laser ablation parameters are increased to ensure complete metal layer removal, then removal completeness is improved, but polymer layer damage increases
Solution Approach 1:
The second metal layer is applied in advance as a protective barrier that absorbs or deflects excess laser energy. This allows the use of higher laser parameters for complete first metal layer removal without transferring harmful energy to the polymer layer, as the second metal layer serves as a sacrificial shield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enables the production of thin, accurate multilayer wires suitable for electrochemical sensors with improved signal-to-noise ratio and linearity, while maintaining the integrity of the polymer layer.
Implementation Method 1
processing the segment of the filament by interaction of the segment with at least one beam of electromagnetic radiation of a first kind; wherein the processed filament comprises the segment, wherein in the segment a thickness of the second layer is less than outside the segment, or b] the second layer has been removed
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The invention relates to a process (100) for preparing a processed filament (400, 500), comprising as steps a) provision of a filament (300), comprising a segment (901), wherein, at least in the segment (901), the filament (300) comprises i) a core (301), comprising a first metal, ii) a first layer (302) which I) is superimposed on the core (301), and II) comprises a polymer, and iii) a second layer (303) which I) is superimposed on the first layer (302), and II) comprises a second metal; and b) processing the segment (901) of the filament (300) by interaction of the segment (901) with at least one beam of electromagnetic radiation of a first kind (606); wherein the electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, the invention relates to a processed filament (400, 500), obtainable by the process (100); a filament; an electrical device (800), comprising at least a part of the processed filament (400, 500) or the filament; a device (600) for processing a filament (300); a use of at least one laser; and a use of a filament (300).