Processed Substrate Through-Hole Alignment via Simultaneous Exposure
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Solution Overview
Problem
The challenge lies in forming through-holes in processed substrates with aligned central axes, as existing methods struggle to ensure matching opening sizes on both surfaces due to differences in photosensitive resin layer thickness and exposure, leading to misalignment and potential cracking, especially in downsized wafers.
Innovation Solution
A method involving a light transmissive substrate with through-holes having a larger and smaller opening diameter, where the larger opening is no more than 5% larger than the smaller, achieved by exposing photosensitive resin layers on both surfaces simultaneously, with one surface irradiated and the other surface receiving reflected light to ensure equal exposure and matched pattern sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If through-holes are formed in processed substrates using conventional photosensitive resin layer methods, then the substrate can be manufactured, but the opening sizes on both surfaces become mismatched leading to misalignment and potential cracking
Solution Approach 1:
The patent applies parameter changes by controlling the thickness of photosensitive resin layers on both surfaces of the substrate and adjusting exposure conditions to ensure that the pattern sizes formed on both surfaces are substantially equal. This results in through-hole openings with matched dimensions, preventing misalignment and cracking while maintaining substrate strength.
Solution Approach 2:
The patent employs preliminary action by forming patterns on both surfaces of the substrate before forming the through-holes. The patterns are designed and formed in advance with controlled dimensions to ensure that when etching is performed, the through-hole openings on both surfaces will be substantially equal in size, preventing subsequent misalignment issues.
2Productivity
If the processed substrate is downsized to match the wafer size, then integration density is improved, but the through-hole openings become too fine to align accurately
Solution Approach 1:
The patent applies parameter changes by carefully controlling the thickness of photosensitive resin layers and exposure parameters to maintain pattern sizes that are substantially equal on both surfaces, even when the substrate is downsized. This ensures that through-hole openings remain alignable and prevent cracking in the downsized configuration.
3Ease of manufacture
If removal liquid is introduced through through-holes to detach the processed substrate, then the substrate can be removed, but misaligned openings reduce removal efficiency
Solution Approach 1:
The patent applies parameter changes by controlling photosensitive resin layer thickness and exposure conditions to ensure through-hole openings on both surfaces are substantially equal in size and properly aligned. This alignment ensures efficient removal liquid flow through the through-holes, improving substrate removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in through-holes with matched opening sizes on both surfaces, enhancing the substrate's strength and efficiency in manufacturing, while preventing cracking and ensuring effective removal liquid access during processing.
Implementation Method 1
irradiating one surface of the substrate with light which then passes through to the other surface
Implementation Method 2
forming a pattern in each of photosensitive resin layers on respective surfaces of the substrate by exposing the each of photosensitive resin layers to light
Data Source
AI summary
A processed substrate and a method for easily manufacturing the processed substrate with high efficiency are provided, the processed substrate having openings in respective surfaces thereof that are matched to each other in size. The processed substrate includes a light transmissive substrate having a plurality of through-holes. Each of the through-holes has a large-diameter opening and a small-diameter opening, the large-diameter opening being larger in size than the small-diameter opening by 5% or less of the size of the large-diameter opening. As such, through-holes with openings in the respective surfaces of the processed substrate that are matched to each other in size can be provided.