Semiconductor Processing Apparatus Gas Supply Asymmetry

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Solution Overview

Problem

Existing processing apparatuses have inefficiencies in gas supply and maintenance due to non-uniform pipe lengths and complex gas flow configurations, leading to increased footprint, power consumption, and risk of impurity introduction during processing.

Innovation Solution

A processing apparatus with concatenated process modules, each featuring a heat treatment unit with a gas supply unit positioned on one side surface, reducing pipe length variability and simplifying gas flow, while maintaining an inert atmosphere to prevent oxide film formation and facilitating easy maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If gas supply units are disposed on rear surfaces or side surfaces of processing containers, then gas can be supplied into processing containers, but pipe lengths become non-uniform and gas flow configurations become complex

Engineering Contradiction:
Improvegas supply configurationVSAvoidpipe length variability and gas flow configuration
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The gas supply unit is disposed on the side surface of the processing container in an asymmetric position that optimizes pipe routing. This asymmetric arrangement allows for more uniform pipe lengths connecting to the substrate processing areas, reducing the complexity variations in gas flow configurations while maintaining effective gas distribution throughout the container.

Inventive Principle:
Principle #4Asymmetry

2Productivity

If multiple process modules are concatenated, then processing capacity increases, but apparatus footprint increases

Engineering Contradiction:
Improveprocessing capacityVSAvoidapparatus footprint
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The process modules are arranged in a three-dimensional configuration rather than a simple linear concatenation. By utilizing vertical stacking and multi-level positioning, multiple process modules can be integrated into a compact footprint, allowing increased processing capacity without proportionally increasing the apparatus's ground area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The gas supply units and piping systems are nested within the structural framework of the process modules themselves. The gas supply infrastructure is integrated into the module design, with pipes and conduits routed through shared structural elements, reducing the overall space required for gas distribution infrastructure.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Loss of energy

If gas supply units are positioned to reduce pipe length variability, then power consumption decreases and impurity introduction risk is minimized, but maintenance complexity increases

Engineering Contradiction:
Improvepower consumptionVSAvoidmaintenance accessibility
Core Design Contradiction:
Loss of energyVSEase of repair

Solution Approach 1:

The gas supply system is segmented into modular units, each with standardized connection points and uniform pipe lengths. This segmentation allows for easier maintenance and replacement of individual modules without affecting the entire system, while maintaining the benefits of uniform pipe routing for reduced energy consumption and impurity risk.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the apparatus' footprint, improves productivity, and simplifies maintenance by standardizing gas supply and exhaust positions, minimizing impurity risks and process variations across modules.

Implementation Method 1

maintaining an inert atmosphere to prevent oxide film formation

Methodology Applied
Scientific EffectInert atmosphere:

Implementation Method 2

a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates

Methodology Applied
Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS11302542B2Processing apparatus
Publication Date: 2022.04.12 TOKYO ELECTRON LTD
  • US11302542B2 patent drawing
  • US11302542B2 patent drawing
  • US11302542B2 patent drawing

AI summary

A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.