Processing Chamber Airflow Regulation for Temperature Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing substrate processing systems face temperature irregularities in the processing chamber due to downflow airflow, which affects processing quality, especially when using heated processing fluids, as the airflow can cause local cooling and temperature fluctuations.
Innovation Solution
A substrate processing system with a regulator that guides part of the downflow to create an airflow with uniform velocity along the outer surface of the processing chamber, stabilizing the airflow and reducing temperature irregularities by controlling the atmosphere around the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a downflow environment is provided around the processing chamber to prevent contaminants from mixing in, then the cleanliness of the processing environment is improved, but temperature irregularities occur in the processing chamber due to local cooling
Solution Approach 1:
The patent introduces a regulator as an intermediary device between the downflow source and the processing chamber. This regulator guides and distributes the downflow air uniformly around the processing chamber, preventing direct localized cooling while maintaining the protective atmosphere. The regulator acts as a mediator that transforms the harmful concentrated downflow into a beneficial uniform flow pattern.
Solution Approach 2:
The patent changes the flow parameters of the downflow air by using a regulator to control and uniformize the flow velocity distribution. By adjusting and equalizing the flow parameters across different regions of the processing chamber, the system maintains temperature uniformity while preserving the contaminant protection provided by the downflow environment.
2Object-affected harmful factors
If the processing chamber is placed under a downflow environment to control the atmosphere, then contamination prevention is improved, but temperature control deteriorates due to airflow-induced cooling
Solution Approach 1:
The regulator serves as an intermediary device that decouples the contaminant protection function from the temperature control function. It allows the downflow to maintain atmospheric cleanliness while preventing direct impingement that causes temperature instability, thus resolving the conflict between these two requirements.
Solution Approach 2:
The patent applies local quality control by using the regulator to create different flow characteristics in different regions around the processing chamber. The regulator ensures that each region receives appropriately controlled airflow, maintaining both contamination protection and temperature stability locally, which collectively solves the overall contradiction.
3Productivity
If heated processing fluid is supplied to the processing space, then processing effectiveness is improved, but temperature irregularities are exacerbated by the interaction with downflow airflow
Solution Approach 1:
The regulator acts as an intermediary that protects the heated processing fluid system from adverse temperature fluctuations caused by downflow. By uniformizing the airflow around the processing chamber, the regulator prevents localized cooling that would otherwise interfere with the heated processing fluid, thereby maintaining both processing effectiveness and temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses temperature irregularities and ensures consistent processing conditions, improving the quality of substrate processing by maintaining a stable temperature environment.
Implementation Method 1
a regulator for guiding at least part of an air flowing as the downflow to around the processing chamber and generates an airflow having a uniform flow velocity along an outer surface of the processing chamber
Data Source
AI summary
A substrate processing apparatus and a substrate processing system according to the invention includes a processing chamber having a processing space capable of accommodating a substrate inside, being provided with an aperture on a side surface thereof, which communicates with the processing space to cause the substrate to pass therethrough, and being disposed under a downflow environment, a lid part which closes and opens the aperture, a fluid supplier which supplies a heated processing fluid to be used for processing the substrate to the processing space closed by the lid part, and a regulator which guides at least part of an air flowing as the downflow to around the processing chamber and generates an airflow having a uniform flow velocity along an outer surface of the processing chamber.