Processing Chamber Zoning for Uniform Batch Epitaxial Deposition

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Solution Overview

Problem

Semiconductor substrate processing operations face challenges with deposition non-uniformity and limited process adjustability, particularly in batch epitaxial processing, which are exacerbated by complex processing operations and inefficient hardware configurations.

Innovation Solution

The method involves partitioning the processing chamber into zones along two directions, determining group numbers based on zone counts, and connecting gas lines to form groups, with separate main lines for each subset of zones, and using flow guide structures to divide the volume into levels and sections for uniform gas distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If batch epitaxial processing is used, then substrate processing capacity is improved, but deposition uniformity deteriorates

Engineering Contradiction:
Improvesubstrate processing capacityVSAvoiddeposition uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The processing chamber is divided into multiple independently controllable zones (first zone, second zone, third zone, fourth zone) with separate gas supply lines and flow controllers. This segmentation allows different gas flow rates and compositions to be supplied to different zones simultaneously, enabling uniform deposition across multiple substrates while maintaining high processing capacity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each zone is equipped with dedicated gas supply lines and flow controllers that can independently adjust gas flow rates and compositions tailored to the specific deposition requirements of that zone. This local quality control ensures optimal deposition uniformity for each region while maintaining overall high throughput.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If complex processing operations are implemented, then process adjustability is improved, but device complexity deteriorates

Engineering Contradiction:
Improveprocess adjustabilityVSAvoidhardware complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The system segments the processing chamber into multiple zones with independent gas supply infrastructure. This segmentation enables complex processing operations to be performed in a modular fashion, where each zone can be independently controlled and adjusted, making the system more adaptable while managing complexity through standardized modular units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system incorporates dynamically adjustable flow controllers and gas supply lines for each zone, allowing real-time adjustment of gas flow rates and compositions during processing. This dynamic control capability provides high process adjustability while the modular architecture keeps hardware complexity manageable.

Inventive Principle:
Principle #15Dynamics

3Ease of manufacture

If conventional gas distribution is used, then hardware simplicity is maintained, but center-to-edge uniformity deteriorates

Engineering Contradiction:
Improvehardware simplicityVSAvoidcenter-to-edge uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The gas distribution system is segmented into multiple independent gas supply lines (first gas supply line, second gas supply line, third gas supply line, fourth gas supply line) corresponding to different zones. Each line can be independently controlled to provide uniform gas distribution across center-to-edge regions, improving deposition uniformity while maintaining relatively simple hardware through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each zone has dedicated gas supply infrastructure with independent flow controllers that can be adjusted to provide optimal gas distribution for that specific region. This local quality control ensures uniform deposition from center to edge while keeping the overall hardware design simple through standardized modular units.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12467144B2Methods of correlating zones of processing chambers, and related systems and methods
Publication Date: 2025.11.11 APPLIED MATERIALS INC
  • US12467144B2 patent drawing
  • US12467144B2 patent drawing
  • US12467144B2 patent drawing

AI summary

The present disclosure relates to methods of correlating zones of processing chambers, and related systems and methods. In one implementation, a method of correlating zones of a processing chamber includes partitioning the processing volume into a plurality of zones along a first direction of the processing volume and a second direction of the processing volume. The second direction intersects the first direction. The plurality of zones have a first zone number (m), and a second zone number (n). The method includes determining a group number. The determining of the group number includes multiplying a first value by a second value. The first value correlates to a first zone number (m) of a plurality of zones and the second value correlates to a second zone number (n) of the plurality of zones. The method includes grouping the zones into groups having a number that is equal to the group number.