Processing Device With Independent Columns For Grinding Precision
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Solution Overview
Problem
Existing processing devices for semiconductor wafers face precision issues during fine grinding due to vibration transmission from rough grinding, leading to unintended cutting and deformation, which compromises the accuracy of the process.
Innovation Solution
A processing device with independent first and second columns, where the rough grinding and fine grinding stages are separated, allowing the rough grinding means to cause displacement on one column and the fine grinding means to affect the finish shape on the other, thereby maintaining precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If rough grinding and fine grinding are performed on the same column, then device complexity is reduced, but manufacturing precision deteriorates due to vibration transmission
Solution Approach 1:
The processing device is divided into multiple independent columns, with each column dedicated to specific grinding operations. The first column performs rough grinding while the second column performs fine grinding, physically separating the processes to prevent vibration interference and maintain precision.
Solution Approach 2:
The fine grinding operation is extracted from the rough grinding column and placed on a separate second column. This extraction removes the harmful vibration effects from the fine grinding process, allowing high-precision grinding without interference from the rough grinding operations.
2Productivity
If rough grinding is performed with large removal amount, then productivity is improved, but manufacturing precision deteriorates due to vibration and deformation
Solution Approach 1:
The grinding process is segmented into two distinct stages performed on separate columns: rough grinding for high productivity and fine grinding for high precision. This segmentation allows each stage to be optimized independently without compromising the other.
Solution Approach 2:
Rough grinding is performed as a preliminary action on the first column to remove the majority of material quickly and efficiently. This preliminary removal is then followed by fine grinding on the second column to achieve the required precision, with the preliminary action not interfering with the final precision operation.
Data Source
AI summary
A processing device that alleviates the influence of rough grinding and performs fine grinding and processes the work with a satisfactory precision. An index table includes a plurality of chucks for holding a work and transports the work to a rough grinding stage with a rough grinding means for rough grinding the work, a medium grinding stage with a medium grinding means for medium grinding the work, and a fine grinding stage with a fine grinding means for fine grinding the work. A first column extends over the index table and one of the rough grinding means or the fine grinding means is installed. A second column extends over the index table and is independent from the first column, and the medium grinding means is installed and the other one of the rough grinding means or the fine grinding means is arranged parallel to the medium grinding means.