Processing Device NFC Sensor Placement Beneath Opening Cover

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Solution Overview

Problem

The installation of near field communication sensors in processing devices and recording devices affects the appearance of the housing, necessitating improvements to mitigate this impact.

Innovation Solution

A configuration where the near field communication sensor is positioned between the opening surface and a cover member in an orthogonal direction, with the cover member covering the opening in an openable and closeable manner, allowing the sensor to be exposed to the exterior of the housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the near field communication sensor is installed on the outer surface of the housing, then the sensor can be easily accessed, but the appearance of the housing is degraded

Engineering Contradiction:
Improvesensor accessibilityVSAvoidhousing appearance
Core Design Contradiction:
Ease of operationVSShape

Solution Approach 1:

The near field communication sensor is nested within the housing by positioning it in the installation space formed by the cover member and housing body. This allows the sensor to be accessible while remaining concealed within the housing structure, thus maintaining the housing's appearance.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The sensor is positioned in the depth direction (orthogonal to the opening surface) rather than on the outer surface. By utilizing the third dimension (depth), the sensor becomes accessible for operation while being hidden from external view, resolving the contradiction between accessibility and appearance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If additional installation space is provided for the sensor, then the sensor can be properly installed, but the housing structure becomes more complex

Engineering Contradiction:
Improvesensor installationVSAvoidhousing structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The installation space created by the cover member and housing body serves dual purposes: it provides structural closure for the housing and simultaneously serves as the installation space for the near field communication sensor. This multi-functionality eliminates the need for separate sensor installation spaces, simplifying the overall housing structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The functions of the cover member (closure) and sensor mounting (installation space provision) are merged into a single integrated structure. The cover member and housing body together create both the closure space and the sensor installation space, reducing structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12358313B2Processing device and recording device
Publication Date: 2025.07.15 SEIKO EPSON CORP
  • US12358313B2 patent drawing
  • US12358313B2 patent drawing
  • US12358313B2 patent drawing

AI summary

A housing, a processing unit disposed inside the housing, a cover member for covering an opening located in the housing in an openable and closeable manner, and a near field communication sensor disposed in the housing are provided, the processing unit is exposed to an exterior of the housing through the opening, and the near field communication sensor is, with the opening closed by the cover member, located between the opening surface and the cover member in an orthogonal direction orthogonal to an opening surface of the opening.