Integrated Processor Carrier Separator for TIM Bond Breaking

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Solution Overview

Problem

The existing methods for separating processors from heatsinks using thermal interface materials (TIM) are inefficient, often requiring high forces that can damage the processor and occupy excessive space, especially in compact designs like high-end servers, where traditional tools like screwdrivers can cause physical damage and the release levers are not feasible due to space constraints.

Innovation Solution

A compact separator device with a head, blade portion, and shaft is integrated into the processor carrier, allowing for rotational force application without direct contact with the processor, breaking the TIM bond layer effectively while minimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional tools like screwdrivers are used to separate processors from heatsinks, then the TIM bond layer can be broken, but the processor may suffer physical damage and excessive space is required

Engineering Contradiction:

Improveprocessor integrityVSAvoidphysical damage to processor

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an integrated separator device as an intermediary tool between the processor and heatsink. This separator device includes a blade portion that fits into a separator cavity in the processor carrier, allowing controlled insertion and separation without direct contact between external tools and the processor. The separator device mediates the separation process by providing a dedicated interface that prevents harmful forces from being applied directly to the processor.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The separator device is segmented into distinct functional parts: a head portion for tool engagement, a shaft for force transmission, and a blade portion for TIM bond layer separation. This segmentation allows each component to be optimized for its specific function, with the blade portion being thin and precise for targeted separation without requiring excessive force that could damage the processor.

Inventive Principle:

Principle #1Segmentation

2Ease of operation

If release levers are used for component separation, then separation can be achieved, but space constraints in compact designs like high-end servers make them not feasible

Engineering Contradiction:

Improvecomponent separation capabilityVSAvoidspace required in processor assembly

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The separator device is merged with the processor carrier structure, integrating the separation mechanism directly into the existing processor housing. The separator cavity is formed as part of the processor carrier, and the separator device fits within this integrated structure. This merging eliminates the need for separate, space-consuming release levers while maintaining the separation capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The separator device is designed to nest within the processor carrier structure. The blade portion fits into the separator cavity, and the entire separator device can be stored within the compact processor assembly when not in use. This nesting approach minimizes the space required while maintaining full separation functionality.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If high forces are applied to break the TIM bond layer, then separation can be achieved, but the processor may be damaged

Engineering Contradiction:

Improveseparation efficiencyVSAvoidprocessor integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The separator device acts as an intermediary that distributes and controls the applied force. The blade portion inserts into the separator cavity and provides a controlled interface for breaking the TIM bond layer, preventing concentrated high forces from being applied directly to the processor. This mediation allows efficient separation while protecting the processor from damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the direct mechanical force application method (using external tools like screwdrivers) with a controlled mechanical system integrated into the processor carrier. The separator device with its blade portion and cavity provides a controlled mechanical interface that substitutes for crude external tools, enabling force application that is both effective for separation and protective of the processor.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20230019643A1Integrated separator devices for hardware component separation

Publication Date: 2023.01.19 INTEL CORP

AI summary

Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.