Processor Chip Pad Layout for Dense Memory Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In multi-chip semiconductor packages, the vertical stacking of chips is limited due to increased I/O channels and chip numbers, leading to reduced chip density and structural stability, and existing arrangements result in wire overlap and signal transmission errors.
Innovation Solution
A processor chip with chip pads arranged only along the edges, allowing for offset-stacked memory chips and minimizing wire overlap, connected through substrate pads to maintain package thickness and stability while preventing signal errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are arranged in parallel with increased numbers and I/O channels, then capacity and performance are improved, but vertical stacking is reduced and structural stability deteriorates
Solution Approach 1:
The patent transitions from traditional parallel chip arrangement to a vertical stacking configuration, utilizing the third dimension (height) to increase chip density. Multiple chips are stacked vertically with alternating orientations, enabling higher capacity and performance without compromising structural stability through proper mechanical interlocking and bonding.
2Ease of manufacture
If chip pads are arranged in conventional patterns, then manufacturing is simplified, but wire overlap occurs and signal transmission errors increase
Solution Approach 1:
The patent employs asymmetric chip pad arrangements where pads are positioned at specific locations on each chip that account for the alternating orientation in vertical stacking. This asymmetric positioning prevents wire bonds from overlapping between adjacent chips while maintaining reliable signal transmission, resolving the conflict between manufacturing simplicity and signal integrity.
3Quantity of substance
If chips are vertically stacked to increase density, then chip density is improved, but wire overlap increases and signal errors occur
Solution Approach 1:
By positioning chip pads asymmetrically on each chip and alternating the orientation of stacked chips, the patent ensures that wire bonds connecting adjacent chips do not overlap. This asymmetric arrangement maintains high chip density through vertical stacking while preventing signal transmission errors caused by wire overlap.
4Ease of manufacture
If conventional chip arrangements are used, then manufacturing is easier, but package thickness increases and stability is reduced
Solution Approach 1:
The patent adopts vertical stacking to utilize the vertical dimension for chip arrangement, which consolidates the package structure and reduces overall package thickness compared to extended parallel arrangements. The alternating orientation of stacked chips enables compact integration while maintaining manufacturing feasibility through standardized bonding processes.
Data Source
AI summary
A processor chip for a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface and mounted on a package substrate, and a plurality of chip pads disposed on the first surface of the substrate and electrically connected to the package substrate, wherein the first surface is divided into a first area and a second area, the first area includes four sides of the first surface and the second area includes a center of the first surface, and the plurality of chip pads are located on the first area and are arranged on at least a portion of a side of the first surface in a line along the side.