Processor Cooling-Aware Control for Adaptive Thermal Management

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Solution Overview

Problem

Existing cooling solutions for computing devices are inadequate in efficiently dissipating heat from components like processors due to a lack of awareness of the specific cooling capabilities of the cooling system, leading to inefficient heat removal and potential performance limitations.

Innovation Solution

A component cooler system utilizing multiple heat pipes and thermoelectric coolers (TECs) with controlled fluid flow paths and adjustable power supply to adapt cooling based on workload, coupled with a processor that identifies the cooler and configures operating parameters for optimal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional cooling solutions are used without awareness of cooling capabilities, then the system structure remains simple, but heat dissipation efficiency is insufficient

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidsystem complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The cooling system transitions from a static configuration to a dynamic one where the processor can identify the cooler type and adjust operating parameters in real-time based on cooling capabilities, enabling adaptive thermal management that optimizes heat dissipation efficiency

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system implements feedback mechanisms where the processor receives information about the cooler's identity and characteristics, then uses this feedback to configure operating parameters appropriately, creating a closed-loop control system for thermal management

Inventive Principle:
Principle #23Feedback

2Productivity

If cooling capabilities are not identified, then the system is easier to operate, but performance is limited due to inefficient thermal management

Engineering Contradiction:
Improveprocessor performanceVSAvoidsystem configuration complexity
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The system enables self-service operation where the processor automatically identifies the cooler type and configures its own operating parameters without user intervention, eliminating the need for manual thermal management configuration while maximizing performance

Inventive Principle:
Principle #25Self-service

3Reliability

If cooling capabilities are recognized and parameters are adjusted, then heat dissipation efficiency improves, but the system requires more complex control mechanisms

Engineering Contradiction:
Improvethermal management effectivenessVSAvoidcontrol mechanism complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The system performs preliminary identification of the cooler type during initialization, storing this information for subsequent use in parameter configuration, thereby avoiding repeated complex detection processes and reducing overall control complexity

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation efficiency by dynamically adjusting cooling capabilities to match processor demands, improving performance and thermal management in computing devices.

Implementation Method 1

A component cooler system utilizing multiple heat pipes

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

thermoelectric coolers (TECs) with controlled fluid flow paths

Methodology Applied
Scientific EffectThermoelectric cooling: Peltier Effect

Data Source

PatentUS12541234B2Cooling device aware processor
Publication Date: 2026.02.03 ADVANCED MICRO DEVICES INC
  • US12541234B2 patent drawing
  • US12541234B2 patent drawing
  • US12541234B2 patent drawing

AI summary

A method for configuring a processor includes identifying a component cooling device thermally coupled to a processor, and configuring one or more operating parameters of the processor based on the identification of the component cooling device.