Processor Thermal Control Using Cold Plates and Remote Cool Blocks
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Solution Overview
Problem
High-performance microprocessors in portable devices generate significant heat, which, when combined with a small form factor, leads to thermal issues that compromise device performance and longevity.
Innovation Solution
The implementation of advanced thermal solutions, including cold plate systems, thermal retention blocks, and distributed heat sink systems with turbulence elements, to enhance heat dissipation and manage thermal energy effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-density microprocessors are used to improve system performance, then processing capability is improved, but thermal output increases causing performance compromise
Solution Approach 1:
The cooling system is segmented into multiple functional components: cold plate for direct processor cooling, thermal retention block for heat capture, thermal channels for heat transport, and heat sink for heat dissipation. This segmentation allows optimized thermal management at each stage of the heat transfer process.
Solution Approach 2:
The patent introduces thermal channels that extend in the vertical dimension (z-axis) to transport heat away from the processor plane. This dimensional approach allows heat removal without increasing the horizontal footprint, effectively decoupling thermal management from device area constraints.
2Volume of moving object
If device size is reduced to meet portable requirements, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The thermal management system utilizes the vertical dimension extensively, with thermal channels extending downward from the processor through the substrate to heat sink structures. This allows efficient heat dissipation in the z-axis direction without increasing the device's horizontal footprint.
Solution Approach 2:
The cooling components are nested within the device structure: the cold plate is positioned directly on the processor, thermal channels are embedded within the substrate, and heat sink structures are integrated into the device housing. This nesting allows comprehensive thermal management within minimal space.
3Temperature
If thermal retention block is positioned close to processor, then heat capture efficiency is improved, but distance to heat sink increases requiring longer thermal channels
Solution Approach 1:
The thermal retention block is positioned at the optimal location closest to the processor's heat-generating regions, allowing maximum heat capture efficiency. The local placement prioritizes heat capture over minimal channel length, as the thermal channels are designed to efficiently transport heat over the required distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These solutions improve thermal performance by increasing heat transfer areas and optimizing cooling media flow, thereby maintaining device performance and extending the lifespan of portable electronics.
Implementation Method 1
cold plate systems... to enhance heat dissipation
Implementation Method 2
distributed heat sink systems with turbulence elements, to enhance heat dissipation
Implementation Method 3
optimizing cooling media flow, thereby maintaining device performance
Data Source
AI summary
The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.