Sub-Ambient Processor Cooling Using Program Workload Hints

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Solution Overview

Problem

Conventional sub-ambient cooling systems for integrated circuits suffer from thermal lag and inefficiencies due to closed-loop temperature-based control, leading to power wastage and ineffective response to processor workload changes.

Innovation Solution

Implementing an open-loop control system using program workload hints to manage sub-ambient cooling devices, allowing proactive and efficient cooling based on anticipated heat loads, decoupling cooling device operation from processor temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If closed-loop temperature-based control is used for sub-ambient cooling devices, then temperature stability is maintained, but thermal response lag occurs and power efficiency deteriorates

Engineering Contradiction:

Improvetemperature stabilityVSAvoidthermal response lag

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The system performs preliminary cooling actions by anticipating heat loads based on program workload hints before actual temperature rise occurs. The cooling device is activated proactively when workload hints indicate upcoming thermal demands, eliminating the need to wait for temperature-based feedback loops to detect and respond to thermal conditions.

Inventive Principle:

Principle #10Preliminary action

2Temperature

If closed-loop temperature-based control is used for sub-ambient cooling devices, then temperature stability is maintained, but power consumption increases

Engineering Contradiction:

Improvetemperature stabilityVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The digital processor provides self-service by generating workload hints that directly indicate its own thermal demands. This self-reporting mechanism eliminates the need for external temperature sensing and control loops, allowing the cooling system to respond directly to the processor's actual operational state without continuous monitoring and adjustment.

Inventive Principle:

Principle #25Self-service

3Temperature

If sub-ambient cooling devices operate continuously to maintain low temperatures, then cooling effectiveness is maintained, but power inefficiency increases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidpower inefficiency

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The cooling system transitions from static continuous operation to dynamic workload-driven operation. The cooling device adjusts its operation based on real-time workload hints from the processor, activating only when thermal demands are anticipated and deactivating when workloads are low, thereby optimizing the balance between cooling effectiveness and energy efficiency.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency by anticipating heat loads, reducing power consumption, and preventing thermal inertia buildup, thus maintaining optimal processor temperatures with improved responsiveness.

Implementation Method 1

sub-ambient cooling devices such as thermo-electric coolers and micro-refrigerators that are capable of cooling the electronic systems and devices to below ambient temperature

Methodology Applied

Scientific EffectThermoelectric cooling: Peltier Effect

Data Source

PatentUS20250365889A1Control of sub-ambient cooling of integrated circuit systems, apparatus and devices using program workload hints

Publication Date: 2025.11.27 ADVANCED MICRO DEVICES INC

AI summary

Program workload hints are sent from a processor to a sub-ambient cooling controller at or before the start of the program to enable the sub-ambient cooling device so that required cooling of the processor integrated circuit is anticipated before a significant temperature rise in the processor occurs. Program workload hints are used instead of processor temperature so that thermal lag is reduced, thereby reducing processor temperature rise. In addition, power to the sub-ambient cooling device may be turned off near or at completion of the program to minimize cooling power used. Multiple processors may share sub-ambient cooling device fans during thermal load diversity of the processors running programs at different times.