Disaggregated Processor Die Transfer Using Selective Release
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Solution Overview
Problem
Current layer transfer techniques in semiconductor manufacturing require full layer transfers, leading to increased costs and process complexity due to the need to etch away unneeded portions of the transferred layer.
Innovation Solution
The use of selective release technology on a donor substrate in conjunction with a patterned bonding template on a receiver substrate allows for the selective transfer of specific areas of a layer, enabling the reuse of the donor substrate and reducing the need for post-transfer etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If full layer transfer techniques are used, then complete layer transfer is achieved, but costs and process complexity increase due to required etching of unneeded portions
Solution Approach 1:
The patent divides the layer transfer process into selective segments by introducing a release layer that enables portion-by-portion transfer. Instead of transferring the entire layer at once, the release layer allows specific regions to be transferred while leaving other regions on the donor substrate, thereby eliminating the need to etch away unneeded portions and reducing process complexity.
Solution Approach 2:
The patent extracts only the needed portions of the layer from the donor substrate by using a release layer that enables selective release. The release layer is removed only in regions where transfer is desired, allowing precise extraction of required layer portions without affecting other regions, thus avoiding unnecessary etching steps.
2Manufacturing precision
If full layer transfer techniques are used, then complete layer transfer is achieved, but costs increase due to material waste from etching unneeded portions
Solution Approach 1:
The release layer enables segmented transfer where only required regions are transferred to the receiver substrate. This segmentation prevents material waste by ensuring that unneeded portions remain on the donor substrate and are not transferred or etched away, thereby reducing substance loss.
Solution Approach 2:
The patent enables recovery of the donor substrate by leaving unneeded layer portions in place. The release layer allows selective transfer while preserving the donor substrate for potential reuse or for retaining features that will be transferred later, thus reducing material waste and improving resource efficiency.
3Productivity
If selective release technology is used, then donor substrate reuse is enabled, but additional release layer processes are required
Solution Approach 1:
The release layer is formed in advance on the donor substrate before the layer transfer process begins. This preliminary action enables subsequent selective release and transfer operations without requiring complex real-time control, as the release layer is already positioned and configured to facilitate donor substrate reuse.
4Ease of manufacture
If selective area transfer is implemented, then post-transfer etching is eliminated, but selective release mechanisms are needed
Solution Approach 1:
The release layer serves as an intermediary between the layer to be transferred and the donor substrate. This intermediary enables selective release through its removal in specific regions, facilitating area-selective transfer without requiring complex direct control mechanisms. The release layer mediates the transfer process by providing a controllable adhesion interface.
Data Source
AI summary
An embodiment discloses a processor comprising a first die comprising at least one of a processing core or a field programmable gate array, a second die comprising at least a portion of an L1 cache, an L2 cache, or both an L1 cache and an L2 cache, and wherein the first die or the second die is bonded to an adhesive area.