Processor Fastening Structure with Compression Spring for CPU Pressure

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Solution Overview

Problem

The increased pressure load on CPUs due to larger packaging areas and complex circuits in high-performance computing environments, such as servers, is not adequately addressed by existing processor fastening structures, leading to inadequate heat dissipation and contact reliability between the CPU and the processor slot.

Innovation Solution

A processor fastening structure that includes a heat sink base with elastic mechanical parts, such as compression springs, and limiting mechanical parts, which are designed to increase pressure on the CPU by converting elastic force into pressure, ensuring tighter bonding between the heat sink and the CPU, and providing even pressure distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the area of a single processor is increased to improve processing capability, then the processing capability is improved, but the total pressure load on the CPU increases and bonding between the heat sink and CPU becomes insufficient

Engineering Contradiction:
Improveprocessing capabilityVSAvoidbonding strength between heat sink and CPU
Core Design Contradiction:
PowerVSStrength

Solution Approach 1:

The patent introduces an elastic mechanical part (compression spring) that converts elastic force into dynamic pressure on the CPU. The spring mechanism allows the system to adapt to the increased pressure load by providing continuous elastic pressure, ensuring the heat sink maintains tight bonding with the CPU despite the larger processor area and higher power consumption.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the physical state of the mechanical part from rigid to elastic by using a compression spring. This parameter change allows the fastening structure to transform elastic potential energy into mechanical pressure, effectively increasing the bonding strength between the heat sink and the high-power CPU without requiring larger fastening components.

Inventive Principle:
Principle #35Parameter changes

2Power

If the area of a single processor is increased to improve processing capability, then the processing capability is improved, but heat dissipation capability becomes insufficient

Engineering Contradiction:
Improveprocessing capabilityVSAvoidheat dissipation capability
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The elastic mechanical part provides dynamic pressure that ensures continuous thermal contact between the heat sink base and the CPU surface. This elastic pressure compensates for any surface irregularities or thermal expansion, maintaining optimal heat transfer pathways even as the CPU generates more heat due to increased processing capability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The elastic mechanical part acts as an intermediary between the heat sink structure and the CPU, transferring both mechanical pressure and thermal energy. The compression spring ensures intimate contact between the heat sink base and CPU surface, facilitating efficient heat transfer from the high-power processor to the heat dissipation system.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If the area of a single processor is increased to improve processing capability, then the processing capability is improved, but contact reliability between the CPU and processor slot decreases

Engineering Contradiction:
Improveprocessing capabilityVSAvoidcontact reliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The elastic mechanical part introduces dynamic adaptability to the fastening system, allowing it to maintain consistent contact pressure on the CPU's contact points with the processor slot. The compression spring compensates for manufacturing tolerances and thermal effects, ensuring reliable electrical and mechanical contact despite the larger CPU area and increased complexity.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the total pressure load on the CPU, ensuring enduring heat dissipation performance and reliable contact between the CPU and the processor slot, even under high processing demands.

Implementation Method 1

the elastic mechanical part provides elastic force for the limiting mechanical part and the heat sink base

Methodology Applied
Scientific EffectElastic force: Elasticity

Implementation Method 2

the compression spring is compressed by shortening a distance between the other end of the limiting mechanical part and the heat sink base

Methodology Applied
Scientific EffectCompression: Compression

Implementation Method 3

a heat sink base that is in contact with a processor... ensuring enduring heat dissipation performance

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11133239B2Mechanical part for fastening processor, assembly, and computer device
Publication Date: 2021.09.28 XFUSION DIGITAL TECH CO LTD
  • US11133239B2 patent drawing
  • US11133239B2 patent drawing
  • US11133239B2 patent drawing

AI summary

In a processor fastening structure, when a compression spring (23) is compressed by shortening a distance between the other end of a screw (24) and a heat sink base (22), the compression spring (23) provides elastic force for both the screw (24) and the heat sink base (22). In addition, because the screw (24) passes through the compression spring (23) to connect to a fastening assembly (21), the elastic force of the compression spring (23) is converted into pressure from the heat sink base (22) to a CPU.