Processor Thermal Fluctuation Control Using Idle Workloads

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Solution Overview

Problem

High-performance semiconductor processors experience reliability issues due to significant thermal fluctuations, which can lead to premature degradation and failure of solder joints and other interfaces, especially in high-performance computing applications where intense computational workloads result in large temperature variations between active and idle periods.

Innovation Solution

Implementing a thermal fluctuations controller that opportunistically executes an idle workload during processor idle periods to maintain the temperature within a threshold range of the peak temperature, reducing the frequency of large thermal fluctuations by producing heat sufficient to keep the processor at a stable temperature, and incorporating a timeout mechanism to conserve power when extended idle periods occur.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the processor executes intensive computational workloads to achieve high performance, then computing power and productivity are improved, but thermal fluctuations increase causing reliability degradation

Engineering Contradiction:
Improvecomputing powerVSAvoidreliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system executes idle workloads periodically during idle periods to generate heat and maintain temperature stability. The thermal fluctuations controller monitors temperature and triggers idle workload execution when temperature drops below a threshold, creating a periodic heating action that counteracts thermal fluctuations without affecting primary computing performance.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system converts the harmful effect of idle periods (temperature drops causing thermal stress) into a beneficial effect by executing idle workloads that generate necessary heat. This transforms the problematic idle state into an opportunity for thermal management, where previously wasted computational cycles now serve to maintain optimal operating temperature and reduce thermal stress on solder joints.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If the processor maintains high temperature during idle periods to reduce thermal fluctuations, then reliability is improved, but power consumption increases

Engineering Contradiction:
ImprovereliabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The thermal fluctuations controller continuously monitors the processor temperature and uses this feedback to dynamically决定是否 execute idle workloads. When temperature remains above the threshold, the controller prevents idle workload execution to conserve power. When temperature drops below the threshold, the controller triggers idle workload execution to generate heat. This feedback-based control ensures power is consumed only when necessary for thermal management.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically changes the operational parameters of the processor by switching between active and idle workload states based on temperature conditions. During idle periods, the processor transitions to executing lightweight idle workloads that consume minimal power but generate sufficient heat to maintain temperature stability. This parameter change allows the system to balance power consumption with thermal management needs.

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If idle workloads are executed continuously to maintain temperature, then thermal stability is improved, but computing resources are wasted

Engineering Contradiction:
Improvethermal stabilityVSAvoidenergy waste
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The controller uses temperature feedback to determine when idle workload execution is necessary. Instead of continuous execution, the system monitors temperature and only triggers idle workloads when the temperature drops below a predefined threshold during idle periods. This feedback mechanism ensures thermal stability is maintained only when needed, preventing unnecessary energy waste during periods when temperature is already adequate.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the frequency and severity of thermal fluctuations, thereby increasing the reliability and useful life of semiconductor processors without impacting performance during active periods, while also optimizing power usage.

Implementation Method 1

Processors and other semiconductor devices generate heat when they are performing computations and/or other operations

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

executes an idle workload during idle periods to maintain the temperature within a threshold range of the peak temperature, reducing the frequency of large thermal fluctuations by producing heat sufficient to keep the processor at a stable temperature

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS12135569B2Methods and apparatus to reduce thermal fluctuations in semiconductor processors
Publication Date: 2024.11.05 INTEL CORP
  • US12135569B2 patent drawing
  • US12135569B2 patent drawing
  • US12135569B2 patent drawing

AI summary

Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.