Processor and I/O Hub Integration on Single Die
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Solution Overview
Problem
Current processor and I/O hub implementations suffer from speed reduction, increased power consumption, and additional complexity due to the need for separate integrated circuit devices and additional circuitry, which also occupy more board space.
Innovation Solution
Integrating the I/O hub on the same IC device as the processor, utilizing a wider and slower bus, FIFO devices for deterministic data transfer, sideband signals for power management, and a protocol for controlling power states, while removing unnecessary logic for off-chip communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the processor and I/O hub are provided on different IC devices, then communication between them can be implemented, but speed is reduced due to delay associated with communicating signals between the IC devices
Solution Approach 1:
The patent integrates the I/O hub onto the same IC device as the processor, eliminating the need for separate IC devices and inter-device communication interfaces. This merging of previously separate components directly reduces signal transmission delay and improves communication speed between the processor and I/O hub.
2Use of energy by moving object
If the processor and I/O hub are provided on different IC devices, then communication can be implemented, but power consumption increases due to presence of additional circuitry required to allow for communication between the IC devices
Solution Approach 1:
By integrating the I/O hub and processor on the same IC device, the patent eliminates additional communication circuitry such as inter-IC interfaces and associated control logic. This reduction in circuitry directly decreases power consumption while maintaining communication functionality.
3Area of stationary object
If discrete I/O hub components are used, then communication functionality is provided, but additional board space is required
Solution Approach 1:
The patent consolidates the I/O hub and processor into a single IC device, eliminating the need for separate discrete I/O hub components on the circuit board. This integration directly reduces the board space required while maintaining all necessary communication functionalities.
4Loss of time
If a bus is used to communicate between separate IC devices, then communication can be established, but delay is introduced due to signal transmission between devices
Solution Approach 1:
By integrating the I/O hub and processor on the same IC device, the patent eliminates the need for external bus interfaces and inter-IC communication pathways. This removal of the bus interface directly reduces signal transmission delay and improves communication responsiveness.
Data Source
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AI summary
Methods and apparatus for integration of a processor and an input/output hub are described. In one embodiment, a sideband signal may cause change in a power management state of a processor or an integrated I/O logic. A single integrated circuit die may include both the processor and the integrated I/O logic. Other embodiments are also disclosed.