Processor Lid Carveouts for Cooling Alignment and Light Visibility
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Solution Overview
Problem
Conventional processor designs require large footprints for cooling devices, visually occlude processors, and rely on inefficient low-speed communication pathways for condition detection, limiting visibility and detection capabilities.
Innovation Solution
Processor lids with carveouts that expose lights and connectors for direct high-speed communication, allowing secure mechanical alignment and visibility of processor conditions, while reducing the necessary PCB footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional processor designs use a complete lid covering the processor components, then heat transfer efficiency is improved, but visual visibility of processor conditions and mechanical alignment precision deteriorate
Solution Approach 1:
The lid is segmented by introducing carveouts that divide the continuous lid surface into distinct regions: heat transfer regions and light exposure regions. This segmentation allows different portions of the lid to serve different functions simultaneously, maintaining thermal efficiency while enabling visual detection of processor conditions through LED indicators.
Solution Approach 2:
The lid exhibits local quality differentiation where specific localized areas (carveout regions) have different properties from the rest of the lid. The carveouts create localized openings that allow light passage while the surrounding lid material maintains its heat transfer properties, thus achieving both thermal management and visual indication functions in different locations of the same component.
2Strength
If conventional processor designs use a complete lid covering the processor components, then structural protection is improved, but mechanical alignment precision and detection capability deteriorate
Solution Approach 1:
The lid structure is segmented through carveouts that create distinct functional zones. These segmented regions maintain overall structural integrity while providing localized access points for light emission and detection, enabling the processor to communicate its operational status without compromising the protective enclosure.
Solution Approach 2:
The carveouts act as intermediaries between the enclosed processor components and the external environment. They provide a controlled interface that allows optical signals (LED indicators) to pass through while maintaining the protective barrier, thus mediating between the need for structural protection and the need for external detection of processor conditions.
3Temperature
If conventional processor designs use large footprint cooling devices, then heat dissipation capability is improved, but device compactness and PCB space utilization deteriorate
Solution Approach 1:
The lid integrates multiple functions that were previously separated into distinct components: structural protection, heat transfer, and visual indication. By combining these functions into a single integrated lid structure with carveouts, the design eliminates the need for additional external components and reduces the overall footprint on the PCB while maintaining effective heat dissipation.
Solution Approach 2:
The lid serves multiple universal functions simultaneously: it provides structural protection for the processor, acts as a heat transfer pathway to the cooling device, and incorporates carveouts for visual status indication. This multi-functionality reduces the number of separate components needed, thereby compacting the overall device design and optimizing PCB space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat transfer, compact design, and direct visual indication of processor conditions, overcoming limitations of conventional designs by providing high-speed communication and visibility without reliance on external components.
Implementation Method 1
the lid is fabricated from metal such as plated copper to provide a pathway for heat transfer away from the processor components to a lid surface connected heatsink or processor cooling device
Data Source
AI summary
Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package's internal components and the auxiliary device.