Actively Cooled Processor Lid With Integrated Coolant Chamber
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional passive lids in heat-management systems for high-powered computer processors are inefficient in transferring heat from densely packed semiconductor dies to the coolant, due to multiple thermal interface materials and additional interfaces that increase thermal resistance.
Innovation Solution
An actively cooled heat-dissipation lid is introduced, featuring a first plate in thermal communication with the semiconductor die, a raised sidewall for fastening to the printed circuit board, and a fluid chamber adjacent to the device chamber to facilitate efficient heat transfer using a pressurized coolant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If multiple thermal interface materials are used between the lid and heat-sink, then the heat transfer efficiency decreases due to additional thermal resistance, but the ease of assembly and manufacturing is improved
Solution Approach 1:
The patent merges the lid and heat-sink into a single integrated component, eliminating the thermal interface material layer between them. This integration removes the additional thermal resistance that would otherwise be introduced by TIM layers, thereby improving heat transfer efficiency while simplifying the assembly process by reducing the number of components and steps required.
Solution Approach 2:
The patent extracts and eliminates the thermal interface material from the heat dissipation system by directly integrating the heat-sink with the lid. This removal of the intermediate layer prevents the introduction of additional thermal resistance, allowing heat to transfer more efficiently from the processor through the lid to the coolant without the insulating effect of TIM layers.
2Device complexity
If a passive lid is used for heat dissipation, then the structure is simpler and manufacturing is easier, but the heat removal capability is insufficient for high-powered processors
Solution Approach 1:
The patent applies hydraulic cooling by integrating a fluid channel system directly into the lid structure. Coolant flows through these channels to actively remove heat from the processor, transforming the passive thermal conduction approach into an active convective cooling system. This hydraulic cooling mechanism significantly enhances heat removal capability while maintaining relative structural simplicity through the integration of fluid channels within the lid itself.
Solution Approach 2:
The patent transitions from a static, passive thermal conduction system to a dynamic active cooling system by incorporating flowing coolant through integrated fluid channels. The continuous movement of coolant through the lid creates dynamic heat removal that can adapt to varying thermal loads, significantly improving heat dissipation capability compared to passive thermal conduction alone.
3Loss of energy
If manual installation of heat-sinks and thermal interface materials is used, then the heat transfer efficiency can be adjusted, but the manufacturing time and labor cost increase significantly
Solution Approach 1:
The patent combines the lid, heat-sink, and cooling channels into a single pre-integrated component. This eliminates the manual assembly steps required to install separate heat-sinks and thermal interface materials, dramatically reducing manufacturing time and labor costs. The integrated design maintains optimal heat transfer efficiency through direct thermal coupling while enabling automated manufacturing processes.
Solution Approach 2:
The patent performs the heat transfer optimization in advance by pre-integrating the heat-sink and cooling channels with the lid during manufacturing. This preliminary integration ensures optimal thermal coupling is achieved without requiring manual adjustment during assembly, thereby reducing manufacturing time and labor while preserving heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency by reducing the number of thermal interfaces and increasing the surface area exposed to the coolant, allowing for more effective cooling of high-powered processors and preventing overheating.
Implementation Method 1
The first plate is placed in thermal communication with a heat-generating device... the flowing coolant contacts the second surface of the first plate, thereby removing heat from the heat-generating device
Implementation Method 2
The flowing coolant contacts the second surface of the first plate, thereby removing heat from the heat-generating device
Data Source
AI summary
Actively cooled heat-dissipation lid for removing excess heat from heat-generating devices attached to printed circuit boards, processor assemblies and other electronic devices, the actively cooled heat-dissipation lid comprising a first plate configured to be placed in thermal communication with a heat-generating device, a raised sidewall to facilitate fastening the actively cooled heat-dissipation lid to the printed circuit board or processor assembly, and thereby defining a device chamber for the heat-generating devices on the printed circuit board to reside. A second raised sidewall extends from the opposite surface of the first plate to join with a second plate in a spaced relation to the first plate, wherein the opposite surface of the first plate, the second raised sidewall and the second plate together define a fluid chamber that is adjacent to the device chamber, the fluid chamber being configured to prevent any cooling fluid flowing therethrough to enter the adjacent device chamber. An inlet conduit in fluid communication with the fluid chamber is configured to admit coolant fluid from a pressurized source to pass into the fluid chamber to absorb heat from the second surface of the first plate in thermal communication with the heat-generating device. An outlet conduit in fluid communication with the fluid chamber is configured to let warmed coolant fluid flow out of the fluid chamber and into a closed loop fluid-cooling system, where the coolant fluid is then re-cooled before being pumped back into the fluid chamber via the inlet conduit.