Processor Loading System Using Coupling Posts

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Solution Overview

Problem

Conventional processor loading systems occupy valuable board space and volume adjacent the socket with multiple mounting holes and a lever, limiting trace routing density and power component placement efficiency.

Innovation Solution

A processor loading system that uses a board with a socket, a base member secured by heat dissipater coupling posts, and a loading member with heat dissipater coupling posts, allowing for secure processor mating and heat dissipation without additional obstructions, eliminating the need for a conventional lever.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional mounting holes and lever are used to secure the loading mechanism, then the processor can be mated with the socket, but valuable board space and volume adjacent the socket are occupied

Engineering Contradiction:
Improveprocessor matingVSAvoidboard space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines the mounting function and heat dissipation coupling function into integrated mounting members (posts) that extend from the board. These posts serve dual purposes: securing the loading mechanism and providing coupling points for the heat dissipation device, thereby eliminating the need for separate mounting holes and reducing board space occupation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting members are designed as multi-functional elements that simultaneously perform mechanical mounting of the loading mechanism and serve as coupling points for thermal management. This universal design allows the same structural elements to fulfill multiple functions, reducing the overall component count and board space requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If conventional mounting holes and lever are used to secure the loading mechanism, then the processor can be mated with the socket, but trace routing density is limited

Engineering Contradiction:
Improveprocessor matingVSAvoidtrace routing density
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By merging the mounting and heat dissipation coupling functions into single integrated posts, the patent frees up board area that can be utilized for increased trace routing density. The reduced number of mounting holes allows more space for signal traces to be routed efficiently across the board.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional mounting holes and lever are used to secure the loading mechanism, then the processor can be mated with the socket, but power component placement efficiency is reduced

Engineering Contradiction:
Improveprocessor matingVSAvoidpower component placement
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the lever mechanism from the design, replacing it with a more compact mounting system using posts that extend from the board. This extraction eliminates the space-consuming lever structure, allowing power components to be positioned closer to the socket for improved electrical performance and manufacturing efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from a two-dimensional board surface mounting approach to a three-dimensional structure where mounting members extend vertically from the board. This dimensional change allows the loading mechanism to be secured without occupying valuable planar board space, enabling better power component placement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If a lever is used to provide force on the processor, then the processor can be mated with the socket, but volume adjacent the socket is occupied

Engineering Contradiction:
Improveprocessor matingVSAvoidvolume adjacent socket
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent removes the lever mechanism entirely, replacing it with a compact post-based mounting system. This extraction eliminates the volume-consuming lever structure that extended over the board, freeing up three-dimensional space adjacent to the socket for better thermal management and signal routing.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent moves the force application mechanism from a horizontal lever extending over the board to vertical posts that extend from the board surface. This dimensional reorientation eliminates the need for overhead volume, allowing better utilization of space adjacent to the socket.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8144469B2Processor loading system
Publication Date: 2012.03.27 DELL PROD LP
  • US8144469B2 patent drawing
  • US8144469B2 patent drawing
  • US8144469B2 patent drawing

AI summary

A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts. The component loading system couples a component to the socket while using less board space and volume next to the board than conventional loading systems in order to provide for, for example, increased trace routing volume and closer component positioning adjacent the socket.