Securing Mechanism for Processor Module with Recessed Back Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing securing mechanisms for processor modules are inadequate for thin metallic cases with a narrow gap between the printed circuit board (PCB) and the case, leading to potential interference and insufficient rigidity.
Innovation Solution
A securing mechanism featuring a fastening device on the PCB, a back plate, and a metallic case with a recessed region to accommodate a thickened central region of the back plate, using screws to secure the fastening device to the PCB and back plate, and rivets to secure the case and back plate together, ensuring the required strength and rigidity without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metallic back plate is used to secure the CPU module, then the structural strength is improved, but the distance between the back plate and the thin metallic case becomes insufficient, causing interference
Solution Approach 1:
The back plate transitions from a uniformly thin structure to a multi-dimensional structure with a thickened central region and thinner peripheral region. This dimensional variation allows the central region to provide necessary structural strength while the thinner peripheral region maintains adequate clearance from the metallic case, resolving the interference issue.
Solution Approach 2:
Different regions of the back plate are given different thicknesses to serve different functions: the central region is thickened to provide structural strength and support for the CPU module, while the peripheral region is kept thin to avoid interfering with the metallic case. This local differentiation resolves the contradiction between strength and clearance.
2Length of moving object
If the back plate is made thinner to reduce interference with the case, then the clearance is improved, but the rigidity of the back plate becomes insufficient
Solution Approach 1:
The back plate is designed with varying thickness in the vertical dimension, creating a three-dimensional structure that provides rigidity where needed (central region) while maintaining clearance where required (peripheral region), thus resolving the contradiction between rigidity and clearance.
Solution Approach 2:
The back plate is functionally segmented into a thickened central region for structural support and a thinner peripheral region for clearance, allowing each segment to optimize its properties independently and resolve the contradiction between rigidity and clearance requirements.
3Stability of the object's composition
If a thick back plate is used to maintain rigidity, then the structural stability is improved, but the distance to the thin case becomes insufficient, causing interference
Solution Approach 1:
The back plate employs local quality differentiation with a thickened central region providing structural stability and a thinner peripheral region maintaining distance from the metallic case, thus resolving the contradiction between stability and clearance through spatially varying properties.
Data Source
AI summary
A securing mechanism for retaining a CPU to an electrical connector mounted upon a top surface of the PCB, includes a fastening device mounted upon the top surface of the PCB beside the electrical connector, and a back plate mounted upon the undersurface of the PCB and located between the PCB and a metallic case. The fastening device cooperates with the back plate to be secured to the PCB via a first set of fixing units. The case forms an opening/recessed region to receive a thickened central region of the back plate and is secured to the back plate via a second set of fixing units surrounding said opening. The thickened central region is fully received within the opening in the vertical direction. The first set of fixing units are located in the central region of the back plate.