Processor Package Optical I/O Layout for Multi-Interface Routing
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Solution Overview
Problem
The complexity and increased size of server CPU packages due to multiple I/O and memory interfaces lead to sub-optimal bandwidth utilization, increased manufacturing costs, and design and testing complexities, as well as a tradeoff between IO and compute performance.
Innovation Solution
A processor package with universal optical input/output (I/O) that co-packages compute and photonic dies on a substrate, using virtual optical channels to route all I/O interfaces except power and ground through the photonic die, reducing the need for dedicated electrical contacts on the socket and enabling smaller footprints and simplified designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple optimized I/O and memory interfaces are used, then performance and functionality are improved, but package size and device complexity increase
Solution Approach 1:
The patent implements a universal optical I/O interface that can handle multiple types of I/O and memory traffic (DDR, PCIe, USB, DisplayPort, etc.) through a single optical channel type, eliminating the need for separate optimized interfaces for each protocol. This multi-functional approach maintains versatility while reducing package complexity.
Solution Approach 2:
The patent replaces traditional electrical I/O interfaces with optical I/O interfaces, substituting electrical signal transmission with optical signal transmission. This substitution enables universal handling of different I/O types through optical channels while reducing electrical interference and signal integrity issues associated with multiple electrical interfaces.
2Productivity
If multiple optimized I/O and memory interfaces are used, then performance is improved, but manufacturing cost increases
Solution Approach 1:
By creating a universal optical I/O interface that handles multiple protocols, the patent reduces the number of different interface types that need to be manufactured and validated. This standardization lowers manufacturing costs while maintaining high bandwidth utilization through optical transmission capabilities.
Solution Approach 2:
The patent changes the transmission medium parameter from electrical to optical, enabling higher bandwidth utilization while simplifying the manufacturing process. Optical interfaces can achieve higher data rates with simpler routing compared to multiple electrical interfaces, reducing overall manufacturing complexity and cost.
3Reliability
If multiple optimized I/O and memory interfaces are used, then specific task performance is improved, but validation time increases
Solution Approach 1:
The universal optical I/O interface consolidates multiple protocol handlers into a single interface type, reducing the number of validation scenarios needed. While maintaining support for DDR, PCIe, USB, and other protocols, the unified optical interface requires fewer validation tests compared to validating each separate electrical interface type.
Solution Approach 2:
Replacing electrical interfaces with optical interfaces simplifies the validation process by eliminating electrical interference and signal integrity issues that require extensive testing. Optical signals provide cleaner transmission with fewer failure modes, reducing validation time while maintaining reliable I/O performance.
4Adaptability or versatility
If multiple optimized I/O and memory interfaces are used, then functionality is improved, but routing complexity increases
Solution Approach 1:
The patent implements a universal optical I/O interface that can route different types of I/O traffic (memory, storage, display, peripherals) through a single optical channel type. This eliminates the need for complex routing logic to direct different protocols through different electrical interfaces, simplifying the overall routing architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies package design, increases compute density, reduces validation time, and enables high-bandwidth connectivity, leading to improved total cost of ownership and scalable architectures without compromising performance.
Implementation Method 1
The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels
Data Source
AI summary
A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.